Inventor

LEE HAKSUN

KR3 patents

⚠️ This page may combine multiple inventors who share the name “LEE HAKSUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ELECTRONICS AND TELELCOMMUNICATIONS RES INSTITUTE

1 patent

US9853010B2Dec 26, 2017

Method of fabricating a semiconductor package

ELECTRONICS AND TELELCOMMUNICATIONS RES INSTITUTE7 citations77

ELECTRONICS & TELECOMMUNICATIONS RES INST

1 patent

US9538666B2Jan 3, 2017

Bonding structure of electronic equipment

ELECTRONICS & TELECOMMUNICATIONS RES INST1 citations50

KOREA ELECTRONICS TELECOMM

1 patent

US9006037B2Apr 14, 2015

Methods of forming bump and semiconductor device with the same

KOREA ELECTRONICS TELECOMM0 citations50