Inventor
PUTTLITZ SR KARL J
US4 patents
Patents
4 patentsUS6805974B2Oct 19, 2004
Lead-free tin-silver-copper alloy solder composition
IBM59 citations94
US6287126B1Sep 11, 2001
Mechanical attachment means used as electrical connection
IBM58 citations94
US5868304AFeb 9, 1999
Socketable bump grid array shaped-solder on copper spheres
IBM19 citations80
US6070782AJun 6, 2000
Socketable bump grid array shaped-solder on copper spheres
IBM3 citations59