Inventor
MAIER DOMINIC
DE28 patents
⚠️ This page may combine multiple inventors who share the name “MAIER DOMINIC”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
27 patentsUS8890284B2Nov 18, 2014
Semiconductor device
INFINEON TECHNOLOGIES AG17 citations92
US8828807B1Sep 9, 2014
Method of packaging integrated circuits and a molded substrate with non-functional placeholders embedded in a molding compound
INFINEON TECHNOLOGIES AG11 citations83
US11195787B2Dec 7, 2021
Semiconductor device including an antenna
INFINEON TECHNOLOGIES AG7 citations82
US10186468B2Jan 22, 2019
System and method for a transducer in an eWLB package
INFINEON TECHNOLOGIES AG6 citations82
US9099454B2Aug 4, 2015
Molded semiconductor package with backside die metallization
INFINEON TECHNOLOGIES AG8 citations81
US9368435B2Jun 14, 2016
Electronic component
INFINEON TECHNOLOGIES AG4 citations73
US9981843B2May 29, 2018
Chip package and a method of producing the same
INFINEON TECHNOLOGIES AG2 citations72
US10549985B2Feb 4, 2020
Semiconductor package with a through port for sensor applications
INFINEON TECHNOLOGIES AG4 citations71
US10546752B2Jan 28, 2020
System and method for a transducer in an eWLB package
INFINEON TECHNOLOGIES AG1 citations71
US10435292B2Oct 8, 2019
Method for producing a semiconductor module
INFINEON TECHNOLOGIES AG2 citations71
US9725303B1Aug 8, 2017
Semiconductor device including a MEMS die and a conductive layer
INFINEON TECHNOLOGIES AG5 citations71
US10161908B2Dec 25, 2018
Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrodynamic pressure of the fluid
INFINEON TECHNOLOGIES AG2 citations67
US11609180B2Mar 21, 2023
Emitter package for a photoacoustic sensor
INFINEON TECHNOLOGIES AG2 citations66
US11492249B2Nov 8, 2022
MEMS sensor, MEMS sensor system and method for producing a MEMS sensor system
INFINEON TECHNOLOGIES AG1 citations62
US9275878B2Mar 1, 2016
Metal redistribution layer for molded substrates
INFINEON TECHNOLOGIES AG2 citations62
US9147585B2Sep 29, 2015
Method for fabricating a plurality of semiconductor devices
INFINEON TECHNOLOGIES AG2 citations62
US11040872B2Jun 22, 2021
Semiconductor module
INFINEON TECHNOLOGIES AG0 citations61
US11211298B2Dec 28, 2021
System and method for a transducer in an EWLB package
INFINEON TECHNOLOGIES AG0 citations60
US8990744B2Mar 24, 2015
Electrical measurement based circuit wiring layout modification method and system
INFINEON TECHNOLOGIES AG3 citations58
US9988262B2Jun 5, 2018
Temporary mechanical stabilization of semiconductor cavities
INFINEON TECHNOLOGIES AG0 citations52
US9806056B2Oct 31, 2017
Method of packaging integrated circuits
INFINEON TECHNOLOGIES AG0 citations51
US9487392B2Nov 8, 2016
Method of packaging integrated circuits and a molded package
INFINEON TECHNOLOGIES AG0 citations51
US10600690B2Mar 24, 2020
Method for handling a product substrate and a bonded substrate system
INFINEON TECHNOLOGIES AG0 citations50
US10056295B2Aug 21, 2018
Method for handling a product substrate, a bonded substrate system and a temporary adhesive
INFINEON TECHNOLOGIES AG0 citations50
US11279120B2Mar 22, 2022
Device and method for debonding a structure from a main surface region of a carrier
INFINEON TECHNOLOGIES AG0 citations46
US9711462B2Jul 18, 2017
Package arrangement including external block comprising semiconductor material and electrically conductive plastic material
INFINEON TECHNOLOGIES AG0 citations41
US10626012B2Apr 21, 2020
Semiconductor device including a cavity lid
INFINEON TECHNOLOGIES AG0 citations40