Inventor
OU IN-DE
TW7 patents
Patents
7 patentsUS6680529B2Jan 20, 2004
Semiconductor build-up package
ADVANCED SEMICONDUCTOR ENG154 citations98
US6701614B2Mar 9, 2004
Method for making a build-up package of a semiconductor
ADVANCED SEMICONDUCTOR ENG89 citations97
US7586184B2Sep 8, 2009
Electronic package
ADVANCED SEMICONDUCTOR ENG29 citations92
US6750397B2Jun 15, 2004
Thermally enhanced semiconductor build-up package
ADVANCED SEMICONDUCTOR ENG23 citations92
US7060595B2Jun 13, 2006
Circuit substrate and fabrication method thereof
ADVANCED SEMICONDUCTOR ENG22 citations89
US8000107B2Aug 16, 2011
Carrier with embedded component and method for fabricating the same
ADVANCED SEMICONDUCTOR ENG2 citations62
US7256480B2Aug 14, 2007
Lead frame package structure with high density of lead pins arrangement
ADVANCED SEMICONDUCTOR ENG6 citations62