Inventor

ORUI KEN

JP5 patents

⚠️ This page may combine multiple inventors who share the name “ORUI KEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SONY CORP

4 patents

US7421777B2Sep 9, 2008

Method of manufacturing multilayer wiring substrate using temporary metal support layer

SONY CORP12 citations79

US7420127B2Sep 2, 2008

Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate

SONY CORP6 citations72

US7053315B2May 30, 2006

Junction structure and junction method for conductive projection

SONY CORP8 citations68

US7288724B2Oct 30, 2007

Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate

SONY CORP0 citations51

ASAMI HIROSHI

1 patent

US8146243B2Apr 3, 2012

Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board

ASAMI HIROSHI3 citations58