P

Inventor

LEE JANG WOO

KR78 patents
⚠️ This page may combine multiple inventors who share the name “LEE JANG WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

22 patents
USD755216SMay 3, 2016

Display screen or portion thereof with graphical user interface

SAMSUNG ELECTRONICS CO LTD66 citations98
USD755215SMay 3, 2016

Display screen or portion thereof with graphical user interface

SAMSUNG ELECTRONICS CO LTD127 citations98
USD754700SApr 26, 2016

Display screen or portion thereof with graphical user interface

SAMSUNG ELECTRONICS CO LTD84 citations98
US7450177B2Nov 11, 2008

Apparatus and method to control caption positioning

SAMSUNG ELECTRONICS CO LTD43 citations93
US10824575B2Nov 3, 2020

Buffer device supporting training operations for a plurality of memory devices, and memory module and memory system each including the buffer device

SAMSUNG ELECTRONICS CO LTD8 citations84
US9778816B2Oct 3, 2017

Method of and device for managing applications

SAMSUNG ELECTRONICS CO LTD8 citations84
US9230876B2Jan 5, 2016

Stack type semiconductor package

SAMSUNG ELECTRONICS CO LTD13 citations84
US7411796B2Aug 12, 2008

Display apparatus having a display module that supports various functions

SAMSUNG ELECTRONICS CO LTD10 citations84
US6962290B2Nov 8, 2005

Bread maker and control method thereof

SAMSUNG ELECTRONICS CO LTD12 citations84
US6729227B2May 4, 2004

Bread maker

SAMSUNG ELECTRONICS CO LTD7 citations74
US11016637B2May 25, 2021

Method of and device for managing applications

SAMSUNG ELECTRONICS CO LTD3 citations73
US10497670B2Dec 3, 2019

Multi-chip package capable of testing internal signal lines

SAMSUNG ELECTRONICS CO LTD4 citations72
US12057366B2Aug 6, 2024

Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations71
US11600545B2Mar 7, 2023

Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package

SAMSUNG ELECTRONICS CO LTD2 citations71
US11069592B2Jul 20, 2021

Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure

SAMSUNG ELECTRONICS CO LTD3 citations71
US10754563B2Aug 25, 2020

Memory device for efficiently determining whether to perform re-training operation and memory system including the same

SAMSUNG ELECTRONICS CO LTD6 citations71
US10964618B2Mar 30, 2021

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD3 citations69
US7348936B2Mar 25, 2008

Display device and image processing method thereof

SAMSUNG ELECTRONICS CO LTD6 citations63
US12300665B2May 13, 2025

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations62
US11227855B2Jan 18, 2022

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations62
US10482937B2Nov 19, 2019

Memory devices and memory systems including the same

SAMSUNG ELECTRONICS CO LTD1 citations62
US6935224B2Aug 30, 2005

Bread maker and control method thereof

SAMSUNG ELECTRONICS CO LTD2 citations62

SEO WON CHEOL

3 patents

LG ELECTRONICS INC

3 patents

SANDISK TECHNOLOGIES LLC

3 patents

LEE JANG WOO

3 patents

SEOUL VIOSYS CO LTD

2 patents

DL CHEMICAL CO LTD

2 patents

JEONG CHUN SEOK

2 patents

3 G TECHNOLOGY

1 patent

HITECH PARTS CO LTD

1 patent

LEE JUNG-DO

1 patent

DONGBU DAEWOO ELECTRONICS CORP

1 patent

SUH SEUNG BUM

1 patent

HANG SANG IND CO LTD

1 patent

SAMSUNG SDI CO LTD

1 patent

REARTH INC

1 patent

3G TECHNOLOGY CO LTD

1 patent

SEOUL OPTO DEVICE CO LTD

1 patent

Showing the top 50 of 78 patents by PatentIndex Score.