Inventor
SHIN INSUP
KR7 patents
⚠️ This page may combine multiple inventors who share the name “SHIN INSUP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
4 patentsUS10361177B2Jul 23, 2019
Semiconductor package having a molding layer including a molding cavity and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations72
US11721601B2Aug 8, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations60
US11756935B2Sep 12, 2023
Chip-stacked semiconductor package with increased package reliability
SAMSUNG ELECTRONICS CO LTD0 citations46
US12230575B2Feb 18, 2025
Carrier structure including pockets for accommodating semiconductor chip stack structure
SAMSUNG ELECTRONICS CO LTD0 citations41