Inventor

TONG MICHAEL SHOU-MING

US3 patents

⚠️ This page may combine multiple inventors who share the name “TONG MICHAEL SHOU-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YANG CHING-JUNG

2 patents

US8610267B2Dec 17, 2013

Reducing delamination between an underfill and a buffer layer in a bond structure

YANG CHING-JUNG2 citations61

US9117831B2Aug 25, 2015

Seal ring structure for integrated circuit chips

YANG CHING-JUNG3 citations60

TAIWAN SEMICONDUCTOR MFG

1 patent

US8963328B2Feb 24, 2015

Reducing delamination between an underfill and a buffer layer in a bond structure

TAIWAN SEMICONDUCTOR MFG4 citations72