Inventor
JINDAL ANURAG
IN34 patents
⚠️ This page may combine multiple inventors who share the name “JINDAL ANURAG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
13 patentsUS9099442B2Aug 4, 2015
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
MICRON TECHNOLOGY INC4 citations83
US10546777B2Jan 28, 2020
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
MICRON TECHNOLOGY INC1 citations72
US9754825B2Sep 5, 2017
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
MICRON TECHNOLOGY INC3 citations72
US9773807B1Sep 26, 2017
Conductive components and memory assemblies
MICRON TECHNOLOGY INC4 citations70
US12237217B2Feb 25, 2025
Methods of exposing conductive Vias of semiconductor devices and related semiconductor devices
MICRON TECHNOLOGY INC0 citations62
US11011420B2May 18, 2021
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
MICRON TECHNOLOGY INC0 citations62
US10847442B2Nov 24, 2020
Interconnect assemblies with through-silicon vias and stress-relief features
MICRON TECHNOLOGY INC1 citations62
US9922875B2Mar 20, 2018
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
MICRON TECHNOLOGY INC1 citations62
US10014319B1Jul 3, 2018
Conductive components and memory assemblies
MICRON TECHNOLOGY INC1 citations60
US10475810B2Nov 12, 2019
Conductive components and memory assemblies
MICRON TECHNOLOGY INC0 citations49
US9627295B2Apr 18, 2017
Devices, systems and methods for manufacturing through-substrate vias and front-side structures
MICRON TECHNOLOGY INC1 citations49
US9305865B2Apr 5, 2016
Devices, systems and methods for manufacturing through-substrate vias and front-side structures
MICRON TECHNOLOGY INC0 citations49
US11742282B2Aug 29, 2023
Conductive interconnects
MICRON TECHNOLOGY INC0 citations47
JINDAL ANURAG
6 patentsUS9297855B1Mar 29, 2016
Integrated circuit with increased fault coverage
JINDAL ANURAG18 citations82
US9213063B2Dec 15, 2015
Reset generation circuit for scan mode exit
JINDAL ANURAG4 citations72
US9599673B2Mar 21, 2017
Structural testing of integrated circuits
JINDAL ANURAG2 citations71
US8872252B2Oct 28, 2014
Multi-tiered semiconductor apparatuses including residual silicide in semiconductor tier
JINDAL ANURAG3 citations59
US9201116B1Dec 1, 2015
Method of generating test patterns for detecting small delay defects
JINDAL ANURAG0 citations44
US9330975B2May 3, 2016
Integrated circuit substrates comprising through-substrate vias and methods of forming through-substrate vias
JINDAL ANURAG0 citations41
NXP USA INC
4 patentsUS11144677B2Oct 12, 2021
Method and apparatus for digital only secure test mode entry
NXP USA INC3 citations63
US12265776B2Apr 1, 2025
Identifying test coverage gaps for integrated circuit designs based on node testability and physical design data
NXP USA INC0 citations44
US11513153B2Nov 29, 2022
System and method for facilitating built-in self-test of system-on-chips
NXP USA INC0 citations44
US11821946B2Nov 21, 2023
Built in self test (BIST) for clock generation circuitry
NXP USA INC0 citations43
FREESCALE SEMICONDUCTOR INC
3 patentsUS9599672B2Mar 21, 2017
Integrated circuit with scan chain having dual-edge triggered scannable flip flops and method of operating thereof
FREESCALE SEMICONDUCTOR INC22 citations87
US9766289B2Sep 19, 2017
LBIST debug controller
FREESCALE SEMICONDUCTOR INC9 citations79
US9568551B1Feb 14, 2017
Scan wrapper circuit for integrated circuit
FREESCALE SEMICONDUCTOR INC12 citations79