P

Inventor

JINDAL ANURAG

IN34 patents
⚠️ This page may combine multiple inventors who share the name “JINDAL ANURAG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

13 patents
US9099442B2Aug 4, 2015

Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

MICRON TECHNOLOGY INC4 citations83
US10546777B2Jan 28, 2020

Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

MICRON TECHNOLOGY INC1 citations72
US9754825B2Sep 5, 2017

Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

MICRON TECHNOLOGY INC3 citations72
US9773807B1Sep 26, 2017

Conductive components and memory assemblies

MICRON TECHNOLOGY INC4 citations70
US12237217B2Feb 25, 2025

Methods of exposing conductive Vias of semiconductor devices and related semiconductor devices

MICRON TECHNOLOGY INC0 citations62
US11011420B2May 18, 2021

Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

MICRON TECHNOLOGY INC0 citations62
US10847442B2Nov 24, 2020

Interconnect assemblies with through-silicon vias and stress-relief features

MICRON TECHNOLOGY INC1 citations62
US9922875B2Mar 20, 2018

Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods

MICRON TECHNOLOGY INC1 citations62
US10014319B1Jul 3, 2018

Conductive components and memory assemblies

MICRON TECHNOLOGY INC1 citations60
US10475810B2Nov 12, 2019

Conductive components and memory assemblies

MICRON TECHNOLOGY INC0 citations49
US9627295B2Apr 18, 2017

Devices, systems and methods for manufacturing through-substrate vias and front-side structures

MICRON TECHNOLOGY INC1 citations49
US9305865B2Apr 5, 2016

Devices, systems and methods for manufacturing through-substrate vias and front-side structures

MICRON TECHNOLOGY INC0 citations49
US11742282B2Aug 29, 2023

Conductive interconnects

MICRON TECHNOLOGY INC0 citations47

JINDAL ANURAG

6 patents

NXP USA INC

4 patents

FREESCALE SEMICONDUCTOR INC

3 patents

SINGH NITIN

2 patents

LI HONGQI

2 patents

AHMED NISAR

1 patent

HUANG WAYNE H

1 patent

NANYA TECHNOLOGY CORP

1 patent

BUSCH BRETT

1 patent