Inventor
AMANAPU HARI P
US6 patents
Patents
6 patentsUS10204829B1Feb 12, 2019
Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers
IBM21 citations93
US10559530B2Feb 11, 2020
Forming dual metallization interconnect structures in single metallization level
IBM4 citations71
US10373867B2Aug 6, 2019
Cobalt contact and interconnect structures
IBM1 citations62
US10177030B2Jan 8, 2019
Cobalt contact and interconnect structures
IBM1 citations62
US11037875B2Jun 15, 2021
Forming dual metallization interconnect structures in single metallization level
IBM0 citations61
US11031337B2Jun 8, 2021
Forming dual metallization interconnect structures in single metallization level
IBM1 citations61