Inventor

HSIEH YU-TE

TW24 patents

⚠️ This page may combine multiple inventors who share the name “HSIEH YU-TE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSIEH YU-TE

SEMICONDUCTOR COMPONENTS IND LLC

Method for defining a gap height within an image sensor package

Image sensors with contamination barrier structures

Stack packaging structure for an image sensor

Image sensor package having a light blocking member

Image sensor semiconductor packages and related methods

Image sensor packaging structures and related methods

Image sensor package

Semiconductor package structure and related methods

Method for defining a gap height within an image sensor package

Multi-chip packaging structure for an image sensor

Semiconductor package structure and related methods

Multi-chip packaging structure for an image sensor

High reliability wafer level semiconductor packaging

Image sensor package having a light blocking member

Image sensor semiconductor packages and related methods

High reliability wafer level semiconductor packaging

High reliability wafer level semiconductor packaging

High reliability housing for a semiconductor package

Semiconductor die and method of packaging multi-die with image sensor

IND TECH RES INST

Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive

Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed

Method for bonding IC chips to substrates with non-conductive adhesive

Method for forming electrically conductive bumps and devices formed

KINSMAN LARRY

Stacked sensor packaging structure and method