Inventor

SINGH SUNIL K

US23 patents

⚠️ This page may combine multiple inventors who share the name “SINGH SUNIL K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SINGH SUNIL K

GLOBALFOUNDRIES INC

Interconnect formation process using wire trench etch prior to via etch, and related interconnect

Interconnect structure with method of forming the same

Methods and structures for back end of line integration

Integration of air gaps with back-end-of-line structures

Dual photoresist approach to lithographic patterning for pitch reduction

Integrated circuit structure to reduce soft-fail incidence and method of forming same

Lithographic patterning to form fine pitch features

Insulating inductor conductors with air gap using energy evaporation material (EEM)

Insulating inductor conductors with air gap using energy evaporation material (EEM)

Interconnects with non-mandrel cuts formed by early block patterning

Method of forming smooth sidewall structures using spacer materials

Methods and structures for back end of line integration

Via structures and via patterning using oblique angle deposition processes

Method of forming high performance vertical natural capacitor (VNCAP)

Litho-litho-etch double patterning method

Structure and method to reduce shorts and contact resistance in semiconductor devices

GLOBALFOUNDRIES US INC

Integrated circuit structure with fluorescent material, and related methods

Method and related structure to authenticate integrated circuit with authentication film

Capacitor structure with MIM layer over metal pillars

Integrated circuit structure with capacitor electrodes in different ILD layers, and related methods

Capacitor structure for integrated circuit, and related methods

Capacitor structure for integrated circuit and related methods

ADVANCED REALTIME CONTROL SYST

Robotic system, docking station, and surgical tool for collaborative control in minimally invasive surgery