Inventor

NAKANE HISASHI

JP36 patents

⚠️ This page may combine multiple inventors who share the name “NAKANE HISASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAKANE HISASHI

TOKYO OHKA KOGYO CO LTD

Developing solution for positive-working photoresist comprising tmah and non-ionic surfactant

Negative-working photosensitive composition comprising a diphenylamine-melamine condensate and an azide compound

Method for preventing leaching of contaminants from solid surfaces

Apparatus for the treatment of semiconductor wafers by plasma reaction

Apparatus for the treatment of a wafer by plasma reaction

Automatic apparatus for continuous treatment of leaf materials with gas plasma

Liquid compositions for forming silica coating films

Apparatus for treatment with gas plasma

Remover solution for photoresist

Photosensitive resin composition for flexographic printing plates

Containing an arylsulfonic acid, a phenol and a naphalenic solvent

Developing solution for positive-working photoresist comprising a metal ion free organic base and an anionic surfactant

Positive-working O-quinone diazide photoresist composition with 2,3,4-trihydroxybenzophenone

Photomasks for photolithographic fine patterning

Apparatus for automatic semi-batch sheet treatment of semiconductor wafers by plasma reaction

Method for fine pattern formation on a photoresist

Plasma etching method

Apparatus for the treatment of wafer materials by plasma reaction

Aqueous developer solution for positive type photoresists with tetramethyl ammonium hydroxide and trimethyl hydroxyethyl ammonium hydroxide

Method of preparing photoresist material with undercoating of photoextinction agent and condensation product

Light sensitive compositions of polymethyl isopropenyl ketone

Soluble photosensitive resin composition

Method of forming a positive resist pattern in photoresist of o-naphthoquinone diazide and bisazide with UV imaging exposure and far UV overall exposure

Composition and process for ultra-fine pattern formation

Positive-type O-quinone diazide containing photoresist compositions

Positive-working photoresist containing o-naphthoquinone diazide sulfonic acid ester and novolak resin consisting of 35 to 43% m-cresol and 65 to 57% p-cresol with substantial absence of o-cresol

Undercoating material for photosensitive resins

Method for fine pattern formation on a photoresist

TOKYO DENSHI KAGAKU KK

Method for pattern-wise etching of a metallic coating film

Liquid coating composition for forming transparent conductive films and a coating process for using said composition

Wafer holding frame

Method for dry etching of a substrate surface

TOKYO DENSHI KAGAKU KABUSHIKI

Liquid composition for forming a coating film of organopolysiloxane and method for the preparation thereof

Automatic plasma processing device and heat treatment device

Automatic plasma processing device and heat treatment device for batch treatment of workpieces

PHOTOPOLY OHKA CO LTD

Method for providing a pattern-wise photoresist layer on a substrate plate and a surface-protected substrate plate therefor