Inventor
YIN WEN
CN26 patents
⚠️ This page may combine multiple inventors who share the name “YIN WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS8930875B2Jan 6, 2015
Estimating power supply of a 3D IC
IBM8 citations83
US10083224B2Sep 25, 2018
Providing global metadata in a cluster computing environment
IBM2 citations73
US9870312B2Jan 16, 2018
Generating reusable testing procedures
IBM2 citations71
US10229038B2Mar 12, 2019
Generating reusable testing procedures
IBM1 citations61
US9098671B2Aug 4, 2015
Power delivery network analysis
IBM3 citations54
US10268754B2Apr 23, 2019
Full text indexing in a database system
IBM0 citations52
US10210241B2Feb 19, 2019
Full text indexing in a database system
IBM0 citations52
US10083221B2Sep 25, 2018
Providing global metadata in a cluster computing environment
IBM0 citations52
US9898258B2Feb 20, 2018
Versioning of build environment information
IBM1 citations51
US10839130B1Nov 17, 2020
Metal layer routing based on grid regions
IBM0 citations50
US9910857B2Mar 6, 2018
Data management
IBM0 citations39
US10565347B2Feb 18, 2020
Global routing optimization
IBM0 citations27
HUAWEI TECH CO LTD
5 patentsUS12471331B2Nov 11, 2025
Field effect transistor and preparation method thereof, and semiconductor structure
HUAWEI TECH CO LTD0 citations62
US12367099B2Jul 22, 2025
Error correction method and apparatus
HUAWEI TECH CO LTD0 citations62
US12287665B2Apr 29, 2025
Clock circuit in a processor integrated circuit
HUAWEI TECH CO LTD0 citations51
US12518000B2Jan 6, 2026
Data processing methods and apparatus switchable between secure and non-secure environments
HUAWEI TECH CO LTD0 citations49
US12455843B2Oct 28, 2025
Data processing system and method
HUAWEI TECH CO LTD0 citations41
QUALCOMM INC
5 patentsUS11694982B2Jul 4, 2023
Sidewall wetting barrier for conductive pillars
QUALCOMM INC0 citations61
US11804428B2Oct 31, 2023
Mixed pad size and pad design
QUALCOMM INC0 citations58
US11189575B1Nov 30, 2021
Specialized surface mount device for symmetric heat distribution in package
QUALCOMM INC0 citations56
US12100649B2Sep 24, 2024
Package comprising an integrated device with a back side metal layer
QUALCOMM INC0 citations50
US11545411B2Jan 3, 2023
Package comprising wire bonds configured as a heat spreader
QUALCOMM INC0 citations47