Inventor
BHAGATH SHRIKAR
US30 patents
⚠️ This page may combine multiple inventors who share the name “BHAGATH SHRIKAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SANDISK CORP
10 patentsUS7259028B2Aug 21, 2007
Test pads on flash memory cards
SANDISK CORP16 citations92
US7816181B1Oct 19, 2010
Method of under-filling semiconductor die in a die stack and semiconductor device formed thereby
SANDISK CORP12 citations84
US7795715B2Sep 14, 2010
Leadframe based flash memory cards
SANDISK CORP12 citations84
US7485501B2Feb 3, 2009
Method of manufacturing flash memory cards
SANDISK CORP18 citations84
USD548740SAug 14, 2007
SIP based flash memory card
SANDISK CORP10 citations84
US7560304B2Jul 14, 2009
Method of making a semiconductor device having multiple die redistribution layer
SANDISK CORP7 citations74
US7791191B2Sep 7, 2010
Semiconductor device having multiple die redistribution layer
SANDISK CORP4 citations63
US7488620B2Feb 10, 2009
Method of fabricating leadframe based flash memory cards including singulation by straight line cuts
SANDISK CORP2 citations63
US7967184B2Jun 28, 2011
Padless substrate for surface mounted components
SANDISK CORP4 citations62
US7495255B2Feb 24, 2009
Test pads on flash memory cards
SANDISK CORP0 citations52
TAKIAR HEM
6 patentsUS8470640B2Jun 25, 2013
Method of fabricating stacked semiconductor package with localized cavities for wire bonding
TAKIAR HEM5 citations72
US8852999B2Oct 7, 2014
System-in-a-package based flash memory card
TAKIAR HEM2 citations62
US8637978B2Jan 28, 2014
System-in-a-package based flash memory card
TAKIAR HEM3 citations62
US8432043B2Apr 30, 2013
Stacked wire bonded semiconductor package with low profile bond line
TAKIAR HEM2 citations62
US8294251B2Oct 23, 2012
Stacked semiconductor package with localized cavities for wire bonding
TAKIAR HEM2 citations62
US8241953B2Aug 14, 2012
Method of fabricating stacked wire bonded semiconductor package with low profile bond line
TAKIAR HEM0 citations41
WESTERN DIGITAL TECH INC
5 patentsUS11830849B2Nov 28, 2023
Semiconductor device with unbalanced die stackup
WESTERN DIGITAL TECH INC2 citations66
US11551991B2Jan 10, 2023
Semiconductor device package having cover portion with curved surface profile
WESTERN DIGITAL TECH INC0 citations61
US11552040B2Jan 10, 2023
Package process, DAF replacement
WESTERN DIGITAL TECH INC0 citations59
US12068041B2Aug 20, 2024
Power reallocation for memory device
WESTERN DIGITAL TECH INC0 citations55
US11985782B2May 14, 2024
Enclosure fitting for electronic device
WESTERN DIGITAL TECH INC0 citations47