Inventor
REDDY SRINIVASA N
US8 patents
⚠️ This page may combine multiple inventors who share the name “REDDY SRINIVASA N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
7 patentsUS5130067AJul 14, 1992
Method and means for co-sintering ceramic/metal mlc substrates
IBM140 citations96
US6461493B1Oct 8, 2002
Decoupling capacitor method and structure using metal based carrier
IBM23 citations92
US4879156ANov 7, 1989
Multilayered ceramic substrate having solid non-porous metal conductors
IBM38 citations92
US4753694AJun 28, 1988
Process for forming multilayered ceramic substrate having solid metal conductors
IBM49 citations92
US6131796AOct 17, 2000
Direct brazing of refractory metal features
IBM16 citations83
US6987316B2Jan 17, 2006
Multilayer ceramic substrate with single via anchored pad and method of forming
IBM7 citations73
US5483105AJan 9, 1996
Module input-output pad having stepped set-back
IBM5 citations62