Inventor
KNICKERBOCKER JOHN
US39 patents
⚠️ This page may combine multiple inventors who share the name “KNICKERBOCKER JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
36 patentsUS11307147B2Apr 19, 2022
Accurate colorimetric based test strip reader system
IBM6 citations85
US10490525B1Nov 26, 2019
High speed handling of ultra-small chips by selective laser bonding and debonding
IBM5 citations84
US10605741B2Mar 31, 2020
Accurate colorimetric based test strip reader system
IBM8 citations83
US9070586B1Jun 30, 2015
Method of forming surface protrusions on an article and the article with the protrusions attached
IBM12 citations83
US12014816B2Jun 18, 2024
Multi-sensor platform for health monitoring
IBM3 citations73
US11973058B2Apr 30, 2024
Multiple die assembly
IBM2 citations73
US9568960B2Feb 14, 2017
Supercomputer using wafer scale integration
IBM2 citations73
US10132836B2Nov 20, 2018
Method of forming surface protrusions on an article and the article with the protrusions attached
IBM2 citations72
US12015003B2Jun 18, 2024
High density interconnection and wiring layers, package structures, and integration methods
IBM0 citations62
US11908723B2Feb 20, 2024
Silicon handler with laser-release layers
IBM0 citations62
US11222862B2Jan 11, 2022
High speed handling of ultra-small chips by selective laser bonding and debonding
IBM0 citations62
US11171374B2Nov 9, 2021
Thin film solid-state microbattery packaging
IBM0 citations62
US10892643B2Jan 12, 2021
Facilitation of charge of and communication with an electronic device
IBM1 citations62
US10833296B2Nov 10, 2020
Thin film solid-state microbattery packaging
IBM1 citations62
US10330701B2Jun 25, 2019
Test probe head for full wafer testing
IBM1 citations62
US12300615B2May 13, 2025
Infrared debond damage mitigation by copper fill pattern
IBM0 citations61
US11810893B2Nov 7, 2023
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection
IBM0 citations61
US11522243B2Dec 6, 2022
Hermetic packaging of a micro-battery device
IBM0 citations61
US11049841B2Jun 29, 2021
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection
IBM1 citations61
US10750955B1Aug 25, 2020
Health and fitness tracking
IBM1 citations61
US10964925B2Mar 30, 2021
Hermetial via seal for thin film battery
IBM0 citations60
US11101513B2Aug 24, 2021
Thin film battery packaging
IBM1 citations59
US11587860B2Feb 21, 2023
Method of forming thin die stack assemblies
IBM0 citations54
US10903153B2Jan 26, 2021
Thinned die stack
IBM0 citations54
US12568846B2Mar 3, 2026
Wafer dies with thermally conducting perimeter regions
IBM0 citations52
US11876233B2Jan 16, 2024
Thin film battery stacking
IBM0 citations52
US11710669B2Jul 25, 2023
Precision thin electronics handling integration
IBM0 citations52
US11315902B2Apr 26, 2022
High bandwidth multichip module
IBM0 citations52
US11094407B2Aug 17, 2021
Electronics miniaturization platform for medication verification and tracking
IBM0 citations52
US9893047B2Feb 13, 2018
Manufacture of wafer—panel die package assembly technology
IBM1 citations52
US9691747B1Jun 27, 2017
Manufacture of wafer—panel die package assembly technology
IBM1 citations52
US12170252B2Dec 17, 2024
Electronic substrate stacking
IBM0 citations51
US11903734B2Feb 20, 2024
Wearable multiplatform sensor
IBM0 citations51
US11539088B2Dec 27, 2022
Ultra-thin microbattery packaging and handling
IBM0 citations50
US10361140B2Jul 23, 2019
Wafer stacking for integrated circuit manufacturing
IBM0 citations40
US10878231B2Dec 29, 2020
Writing recognition using wearable pressure sensing device
IBM0 citations37