Inventor
CADAG ELA MIA
PH22 patents
Patents
22 patentsUS10079198B1Sep 18, 2018
QFN pre-molded leadframe having a solder wettable sidewall on each lead
ST MICROELECTRONICS INC34 citations92
US9953933B1Apr 24, 2018
Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die
ST MICROELECTRONICS INC7 citations83
US9165867B1Oct 20, 2015
Semiconductor device with lead frame contact solder balls and related methods
ST MICROELECTRONICS INC7 citations83
US10109563B2Oct 23, 2018
Modified leadframe design with adhesive overflow recesses
ST MICROELECTRONICS INC6 citations82
US9842794B2Dec 12, 2017
Semiconductor package with integrated heatsink
ST MICROELECTRONICS INC2 citations72
US11069601B2Jul 20, 2021
Leadless semiconductor package with wettable flanks
ST MICROELECTRONICS INC2 citations71
US10957634B2Mar 23, 2021
Modified leadframe design with adhesive overflow recesses
ST MICROELECTRONICS INC1 citations71
US10615104B2Apr 7, 2020
Modified leadframe design with adhesive overflow recesses
ST MICROELECTRONICS INC2 citations71
US10128169B1Nov 13, 2018
Package with backside protective layer during molding to prevent mold flashing failure
ST MICROELECTRONICS INC3 citations71
US11557548B2Jan 17, 2023
Package with interlocking leads and manufacturing the same
ST MICROELECTRONICS INC2 citations70
US10903172B2Jan 26, 2021
Package with interlocking leads and manufacturing the same
ST MICROELECTRONICS INC2 citations70
US10529672B2Jan 7, 2020
Package with interlocking leads and manufacturing the same
ST MICROELECTRONICS INC1 citations70
US12255076B2Mar 18, 2025
Method for manufacturing leadless semiconductor package with wettable flanks
ST MICROELECTRONICS INC0 citations60
US11929259B2Mar 12, 2024
Method for manufacturing leadless semiconductor package with wettable flanks
ST MICROELECTRONICS INC0 citations60
US11552007B2Jan 10, 2023
Modified leadframe design with adhesive overflow recesses
ST MICROELECTRONICS INC0 citations60
US10910295B2Feb 2, 2021
QFN pre-molded leadframe having a solder wettable sidewall on each lead
ST MICROELECTRONICS INC0 citations60
US9818675B2Nov 14, 2017
Semiconductor device including conductive clip with flexible leads and related methods
ST MICROELECTRONICS INC0 citations51
US12211774B2Jan 28, 2025
Lead stabilization in semiconductor packages
ST MICROELECTRONICS INC0 citations50
US10541196B2Jan 21, 2020
QFN pre-molded leadframe having a solder wettable sidewall on each lead
ST MICROELECTRONICS INC0 citations50
US10461019B2Oct 29, 2019
Package with backside protective layer during molding to prevent mold flashing failure
ST MICROELECTRONICS INC0 citations50
US9324643B1Apr 26, 2016
Integrated circuit device having exposed contact pads and leads supporting the integrated circuit die and method of forming the device
ST MICROELECTRONICS INC1 citations47
US11916090B2Feb 27, 2024
Tapeless leadframe package with exposed integrated circuit die
ST MICROELECTRONICS INC0 citations44