Inventor
SONG KENG YEW
SG22 patents
⚠️ This page may combine multiple inventors who share the name “SONG KENG YEW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ASM TECH SINGAPORE PTE LTD
15 patentsUS6827247B1Dec 7, 2004
Apparatus for detecting the oscillation amplitude of an oscillating object
ASM TECH SINGAPORE PTE LTD26 citations89
US11205937B2Dec 21, 2021
Driving system having reduced vibration transmission
ASM TECH SINGAPORE PTE LTD12 citations81
US6749100B2Jun 15, 2004
Multiple-head wire-bonding system
ASM TECH SINGAPORE PTE LTD15 citations79
US6568581B2May 27, 2003
Detection of wire bonding failures
ASM TECH SINGAPORE PTE LTD18 citations78
US9640512B2May 2, 2017
Wire bonding apparatus comprising an oscillator mechanism
ASM TECH SINGAPORE PTE LTD5 citations68
US9881891B1Jan 30, 2018
Method of forming three-dimensional wire loops and wire loops formed using the method
ASM TECH SINGAPORE PTE LTD3 citations67
US9889521B2Feb 13, 2018
Method and system for pull testing of wire bonds
ASM TECH SINGAPORE PTE LTD6 citations66
US6572001B2Jun 3, 2003
Bonding system
ASM TECH SINGAPORE PTE LTD6 citations62
US11205634B2Dec 21, 2021
Bonding apparatus with replaceable bonding tool
ASM TECH SINGAPORE PTE LTD0 citations61
US11239197B2Feb 1, 2022
Wire bonding apparatus threading system
ASM TECH SINGAPORE PTE LTD0 citations60
US11145620B2Oct 12, 2021
Formation of bonding wire vertical interconnects
ASM TECH SINGAPORE PTE LTD0 citations56
US11400495B2Aug 2, 2022
Automated particle removal system having angular adjustability
ASM TECH SINGAPORE PTE LTD1 citations55
US11289446B2Mar 29, 2022
Multiple actuator wire bonding apparatus
ASM TECH SINGAPORE PTE LTD0 citations48
US11227779B2Jan 18, 2022
Apparatus and method for processing a semiconductor device
ASM TECH SINGAPORE PTE LTD0 citations46
US11017996B2May 25, 2021
Automated particle removal system
ASM TECH SINGAPORE PTE LTD0 citations46
ASMPT SINGAPORE PTE LTD
4 patentsUS12510451B2Dec 30, 2025
Method and apparatus for conducting shear tests on interconnect bonds
ASMPT SINGAPORE PTE LTD0 citations54
US12442744B2Oct 14, 2025
Apparatus and method for calibrating a shear test tool
ASMPT SINGAPORE PTE LTD0 citations54
US12457399B2Oct 28, 2025
Camera module assembly
ASMPT SINGAPORE PTE LTD0 citations51
US11543362B2Jan 3, 2023
Method for measuring the heights of wire interconnections
ASMPT SINGAPORE PTE LTD0 citations45
SONG KENG YEW
3 patentsUS10163845B2Dec 25, 2018
Method and apparatus for measuring a free air ball size during wire bonding
SONG KENG YEW2 citations66
US9502374B2Nov 22, 2016
Automatic wire tail adjustment system for wire bonders
SONG KENG YEW3 citations62
US9620477B2Apr 11, 2017
Wire bonder and method of calibrating a wire bonder
SONG KENG YEW0 citations36