Inventor · disambiguated record
Chiung C. Lo
Also filed as: LO CHIUNG · LO CHIUNG C · LO CHIUNG-CHENG
47 granted patents·18 pending applications·235 citations·filing 2009–2025
97Inventor score
Top patents by PatentIndex Score
65 records- 0198US10425732B1Sound producing deviceXMEMS LABS INC·Filed 2018·Granted Sep 24, 2019·36 cites·30 claims
- 0296US12028673B2Driving circuit and wearable sound device thereofXMEMS LABS INC·Filed 2023·Granted Jul 2, 2024·6 cites·28 claims
- 0396US11884535B2Device, package structure and manufacturing method of deviceXMEMS LABS INC·Filed 2022·Granted Jan 30, 2024·4 cites·24 claims
- 0496US11399228B2Acoustic transducer, wearable sound device and manufacturing method of acoustic transducerXMEMS LABS INC·Filed 2021·Granted Jul 26, 2022·13 cites·15 claims
- 0596US11323797B2Acoustic transducer, wearable sound device and manufacturing method of acoustic transducerXMEMS LABS INC·Filed 2021·Granted May 3, 2022·14 cites·23 claims
- 0696US8395381B2Micromachined magnetic field sensorsLO CHIUNG C·Filed 2010·Granted Mar 12, 2013·45 cites·15 claims
- 0795US11711653B2Sound producing cell and manufacturing method thereofXMEMS LABS INC·Filed 2022·Granted Jul 25, 2023·2 cites·7 claims
- 0894US8567246B2Integrated MEMS device and method of useSHAEFFER DEREK·Filed 2010·Granted Oct 29, 2013·20 cites·18 claims
- 0993US10327060B2Air pulse generating element and sound producing deviceXMEMS LABS INC·Filed 2018·Granted Jun 18, 2019·11 cites·18 claims
- 1091US9206032B1Micro-electro-mechanical system (MEMS) chipKANG YU-FU·Filed 2015·Granted Dec 8, 2015·15 cites·5 claims
- 1191US8686560B2Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stressPARVARANDEH PIROOZ·Filed 2010·Granted Apr 1, 2014·15 cites·9 claims
- 1286US12157663B2Venting device, manufacturing method of venting device, venting method and deviceXMEMS LABS INC·Filed 2024·Granted Dec 3, 2024·1 cites·27 claims
- 1386US12088988B2Venting device and venting method thereofXMEMS LABS INC·Filed 2023·Granted Sep 10, 2024·1 cites·21 claims
- 1486US11774320B1Acoustic impedance measuring system and acoustic impedance measuring methodXMEMS LABS INC·Filed 2023·Granted Oct 3, 2023·1 cites·20 claims
- 1586US10609474B2Air pulse generating element and manufacturing method thereofXMEMS LABS INC·Filed 2018·Granted Mar 31, 2020·5 cites·14 claims
- 1686US8947081B2Micromachined resonant magnetic field sensorsSEEGER JOSEPH·Filed 2011·Granted Feb 3, 2015·6 cites·13 claims
- 1786US8860409B2Micromachined resonant magnetic field sensorsSEEGER JOSEPH·Filed 2011·Granted Oct 14, 2014·6 cites·16 claims
- 1884US12192722B2Sound producing cellXMEMS LABS INC·Filed 2023·Granted Jan 7, 2025·0 cites·23 claims
- 1983US8278748B2Wafer-level packaged device having self-assembled resilient leadsLO CHIUNG C·Filed 2010·Granted Oct 2, 2012·6 cites·41 claims
- 2082US9159684B1Wafer-level packaged device having self-assembled resilient leadsMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Oct 13, 2015·4 cites·20 claims
- 2180US11943595B2Sound producing cell and manufacturing method thereofXMEMS LABS INC·Filed 2022·Granted Mar 26, 2024·0 cites·4 claims
- 2280US11706569B2Sound producing cell and manufacturing method thereofXMEMS LABS INC·Filed 2022·Granted Jul 18, 2023·0 cites·4 claims
- 2380US11172300B2Sound producing deviceXMEMS LABS INC·Filed 2021·Granted Nov 9, 2021·1 cites·30 claims
- 2480US9702889B2Micro-electro-mechanical system (MEMS) deviceLIN SHIH-CHIEH·Filed 2015·Granted Jul 11, 2017·2 cites·16 claims
- 2580US8692367B1Wafer-level packaged device having self-assembled resilient leadsMAXIM INTEGRATED PRODUCTS·Filed 2012·Granted Apr 8, 2014·4 cites·7 claims
- 2677US11057716B1Sound producing deviceXMEMS LABS INC·Filed 2020·Granted Jul 6, 2021·1 cites·30 claims
- 2777US8405115B2Light sensor using wafer-level packagingSAMOILOV ARKADII V·Filed 2009·Granted Mar 26, 2013·8 cites·21 claims
- 2874US10979808B2Sound producing deviceXMEMS LABS INC·Filed 2019·Granted Apr 13, 2021·1 cites·18 claims
- 2972US9562926B2Micro-electro-mechanical system (MEMS) device including an internal anchor areaLIN CHIUNG-WEN·Filed 2015·Granted Feb 7, 2017·2 cites·11 claims
- 3070US9073750B2Manufacturing method of micro-electro-mechanical system device and micro-electro-mechanical system device made therebyLO CHIUNG-CHENG·Filed 2014·Granted Jul 7, 2015·2 cites·10 claims
- 3167US2024022859A1Package structure, apparatus and forming methods thereofXMEMS LABS INC·Filed 2023·Application pending·0 cites
- 3266US12404166B2Manufacturing method of deviceXMEMS LABS INC·Filed 2022·Granted Sep 2, 2025·0 cites·10 claims
- 3365US8410562B2Methods, apparatuses, and systems for micromechanical gas chemical sensing capacitorLAZARUS NATHAN·Filed 2011·Granted Apr 2, 2013·3 cites·20 claims
- 3461US2024365048A1Sound producing package and covering structureXMEMS LABS INC·Filed 2024·Application pending·0 cites
- 3560US11991497B1Acoustic device and holder flattening frequency responseXMEMS LABS INC·Filed 2023·Granted May 21, 2024·0 cites·30 claims
- 3659US12172887B2Sound producing package structure including sound producing membranes actuated toward cavity centerXMEMS LABS INC·Filed 2021·Granted Dec 24, 2024·0 cites·15 claims
- 3759US12063470B1Acoustic package structure and covering structureXMEMS LABS INC·Filed 2023·Granted Aug 13, 2024·0 cites·18 claims
- 3859US12022253B2Venting deviceXMEMS LABS INC·Filed 2023·Granted Jun 25, 2024·0 cites·19 claims
- 3959US2025100870A1Controller for sound producing device with dynamic vent functionXMEMS LABS INC·Filed 2024·Application pending·0 cites
- 4054US11252511B2Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatusXMEMS LABS INC·Filed 2021·Granted Feb 15, 2022·0 cites·27 claims
- 4153US11805342B2Sound producing package structure and manufacturing method thereofXMEMS LABS INC·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 4252US11304005B2Crossover circuitXMEMS LABS INC·Filed 2021·Granted Apr 12, 2022·0 cites·11 claims
- 4351US11395081B2Acoustic testing method and acoustic testing system thereofXMEMS LABS INC·Filed 2020·Granted Jul 19, 2022·0 cites·21 claims
- 4451US10771891B2Method for manufacturing air pulse generating elementXMEMS LABS INC·Filed 2019·Granted Sep 8, 2020·0 cites·19 claims
- 4550US2015210541A1MEMS Chip and Manufacturing Method ThereofKANG YU-FU·Filed 2014·Application pending·0 cites
- 4649US2023209269A1Sound producing cell, acoustic transducer and manufacturing method of sound producing cellXMEMS LABS INC·Filed 2023·Application pending·0 cites
- 4747US12453038B2Electronic device and airflow generating packageXMEMS LABS INC·Filed 2025·Granted Oct 21, 2025·0 cites·29 claims
- 4847US11758312B2Sound producing package structure and manufacturing method thereofXMEMS TAIWAN CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·26 claims
- 4947US10477300B2Air pulse generating element and sound producing deviceXMEMS LABS INC·Filed 2019·Granted Nov 12, 2019·0 cites·18 claims
- 5046US2016096728A1MEMS Chip and Manufacturing Method ThereofKANG YU-FU·Filed 2015·Application pending·0 cites
Showing the top 50 of 65 patent records by PatentIndex Score.
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