Inventor
HACKER JONATHAN S
US22 patents
⚠️ This page may combine multiple inventors who share the name “HACKER JONATHAN S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
21 patentsUS9905527B1Feb 27, 2018
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
MICRON TECHNOLOGY INC25 citations93
US9865578B2Jan 9, 2018
Methods of manufacturing multi-die semiconductor device packages and related assemblies
MICRON TECHNOLOGY INC4 citations84
US10396052B2Aug 27, 2019
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
MICRON TECHNOLOGY INC5 citations83
US11004697B2May 11, 2021
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
MICRON TECHNOLOGY INC1 citations73
US10763131B2Sep 1, 2020
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
MICRON TECHNOLOGY INC2 citations73
US10622223B2Apr 14, 2020
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
MICRON TECHNOLOGY INC2 citations73
US10103134B2Oct 16, 2018
Methods of manufacturing multi-die semiconductor device packages and related assemblies
MICRON TECHNOLOGY INC2 citations73
US11527505B2Dec 13, 2022
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
MICRON TECHNOLOGY INC2 citations72
US10002840B1Jun 19, 2018
Semiconductor devices having discretely located passivation material, and associated systems and methods
MICRON TECHNOLOGY INC3 citations70
US11955346B2Apr 9, 2024
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
MICRON TECHNOLOGY INC0 citations62
US11565371B2Jan 31, 2023
Systems and methods for forming semiconductor cutting/trimming blades
MICRON TECHNOLOGY INC0 citations62
US11302653B2Apr 12, 2022
Die features for self-alignment during die bonding
MICRON TECHNOLOGY INC0 citations62
US10748857B2Aug 18, 2020
Die features for self-alignment during die bonding
MICRON TECHNOLOGY INC1 citations62
US11094684B2Aug 17, 2021
Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography
MICRON TECHNOLOGY INC0 citations60
US11402426B2Aug 2, 2022
Inductive testing probe apparatus for testing semiconductor die and related systems and methods
MICRON TECHNOLOGY INC0 citations59
US10896886B2Jan 19, 2021
Semiconductor devices having discretely located passivation material, and associated systems and methods
MICRON TECHNOLOGY INC0 citations59
US10847486B2Nov 24, 2020
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
MICRON TECHNOLOGY INC0 citations51
US10852344B2Dec 1, 2020
Inductive testing probe apparatus for testing semiconductor die and related systems and methods
MICRON TECHNOLOGY INC0 citations49
US10403618B2Sep 3, 2019
Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography
MICRON TECHNOLOGY INC0 citations49
US10262961B2Apr 16, 2019
Semiconductor devices having discretely located passivation material, and associated systems and methods
MICRON TECHNOLOGY INC0 citations49
US10446431B2Oct 15, 2019
Temporary carrier debond initiation, and associated systems and methods
MICRON TECHNOLOGY INC0 citations41