Inventor

THEN EDWARD

NL3 patents

⚠️ This page may combine multiple inventors who share the name “THEN EDWARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

1 patent

US7262077B2Aug 28, 2007

Capillary underfill and mold encapsulation method and apparatus

INTEL CORP9 citations64

Nexperia BV

1 patent

US11817360B2Nov 14, 2023

Chip scale package semiconductor device and method of manufacture

Nexperia BV0 citations41

LOH ALBERT

1 patent

US9196504B2Nov 24, 2015

Thermal leadless array package with die attach pad locking feature

LOH ALBERT1 citations40