Inventor
JHA Chandra Mohan
US23 patents
Patents
23 patentsUS11521914B2Dec 6, 2022
Microelectronic assemblies having a cooling channel
INTEL CORP8 citations86
US11735552B2Aug 22, 2023
Microelectronic package with solder array thermal interface material (SA-TIM)
INTEL CORP6 citations85
US12191220B2Jan 7, 2025
Hybrid interposer of glass and silicon to reduce thermal crosstalk
INTEL CORP2 citations75
US11894282B2Feb 6, 2024
Vented lids for integrated circuit packages
INTEL CORP2 citations72
US11756860B2Sep 12, 2023
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
INTEL CORP3 citations71
US11664293B2May 30, 2023
Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios
INTEL CORP2 citations71
US11694942B2Jul 4, 2023
Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal management
INTEL CORP2 citations70
US11456232B2Sep 27, 2022
Thermal assemblies for multi-chip packages
INTEL CORP4 citations70
US12205915B2Jan 21, 2025
Microelectronic package with solder array thermal interface material (SA-TIM)
INTEL CORP0 citations62
US11854932B2Dec 26, 2023
Package wrap-around heat spreader
INTEL CORP0 citations62
US11837519B2Dec 5, 2023
Heatsink cutout and insulating through silicon vias to cut thermal cross-talk
INTEL CORP0 citations62
US12341080B2Jun 24, 2025
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
INTEL CORP0 citations61
US12021016B2Jun 25, 2024
Thermally enhanced silicon back end layers for improved thermal performance
INTEL CORP0 citations61
US11978689B2May 7, 2024
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
INTEL CORP0 citations61
US11398414B2Jul 26, 2022
Sloped metal features for cooling hotspots in stacked-die packages
INTEL CORP0 citations61
US12347780B2Jul 1, 2025
Integrated circuit package with flipped high bandwidth memory device
INTEL CORP1 citations60
US11756856B2Sep 12, 2023
Package architecture including thermoelectric cooler structures
INTEL CORP0 citations60
US11658095B2May 23, 2023
Bump integrated thermoelectric cooler
INTEL CORP0 citations59
US11462457B2Oct 4, 2022
Using a thermoelectric cooler to reduce heat transfer between heat-conducting plates
INTEL CORP0 citations59
US11705417B2Jul 18, 2023
Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level
INTEL CORP0 citations58
US11587843B2Feb 21, 2023
Thermal bump networks for integrated circuit device assemblies
INTEL CORP0 citations58
US11670561B2Jun 6, 2023
3D buildup of thermally conductive layers to resolve die height differences
INTEL CORP0 citations52
US11502017B2Nov 15, 2022
Effective heat conduction from hotspot to heat spreader through package substrate
INTEL CORP0 citations50