Inventor
PRABHU GAUNKAR NEELAM
US19 patents
Patents
19 patentsUS12598997B2Apr 7, 2026
Inductor with integrated magnetics
INTEL CORP0 citations62
US12573744B2Mar 10, 2026
Wideband antennas in glass through direct via feeding and glass stacking
INTEL CORP0 citations62
US12525496B2Jan 13, 2026
Glass vias and planes with reduced tapering
INTEL CORP0 citations62
US12444619B2Oct 14, 2025
Physical vapor deposition seeding for high aspect ratio vias in glass core technology
INTEL CORP0 citations62
US12424716B2Sep 23, 2025
RF filters and multiplexers manufactured in the core of a package substrate using glass core technology
INTEL CORP0 citations62
US12424719B2Sep 23, 2025
Compact surface transmission line waveguides with vertical ground planes
INTEL CORP0 citations62
US12368091B2Jul 22, 2025
Package substrate with glass core having vertical power planes for improved power delivery
INTEL CORP0 citations62
US12347761B2Jul 1, 2025
Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate
INTEL CORP0 citations62
US11916604B2Feb 27, 2024
Dispersion compensation for electromagnetic waveguides
INTEL CORP0 citations62
US12255225B2Mar 18, 2025
Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodes
INTEL CORP0 citations61
US12255158B2Mar 18, 2025
Components for millimeter-wave communication
INTEL CORP0 citations61
US12166261B2Dec 10, 2024
Components for millimeter-wave communication
INTEL CORP0 citations61
US12126068B2Oct 22, 2024
Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials
INTEL CORP0 citations61
US12126067B2Oct 22, 2024
Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material
INTEL CORP0 citations61
US12107314B2Oct 1, 2024
Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad
INTEL CORP0 citations61
US12021289B2Jun 25, 2024
Components for millimeter-wave communication
INTEL CORP0 citations61
US11955684B2Apr 9, 2024
Components for millimeter-wave communication
INTEL CORP0 citations61
US12489189B2Dec 2, 2025
Contactless communication using a waveguide extending through a substrate core
INTEL CORP0 citations52
US12088360B2Sep 10, 2024
Dispersive waveguide crosstalk mitigation
INTEL CORP0 citations49