Inventor

GOROWITZ BERNARD

US29 patents

⚠️ This page may combine multiple inventors who share the name “GOROWITZ BERNARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GOROWITZ BERNARD

GEN ELECTRIC

Interface structures for electronic devices

Demountable and repairable low pitch interconnect for stacked multichip modules

Fabrication method for thin film capacitors

Method for fabricating a stack of two dimensional circuit modules

Combustion control for producing low NOx emissions through use of flame spectroscopy

Stacking of three dimensional high density interconnect modules with metal edge contacts

Combustion control for producing low NOx emissions through use of flame spectroscopy

Method for tapered dry etching

Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areas

Power field effect devices having small cell size and low contact resistance

Flexible multilayer thin film capacitors

Structure for thin film capacitors

Method of making mo/tiw or w/tiw ohmic contacts to silicon

Method of filling interlevel dielectric via or contact holes in multilevel VLSI metallization structures

Processes and gas mixtures for the reactive ion etching of aluminum and aluminum alloys

Metallization contact system for large scale integrated circuits

Ohmic contacts and interconnects to silicon and method of making same

Electrostatic-fluidized bed coating of wire

Apparatus for electrostatic deposition on a running conductor

Powder coatable polyester composition and electrical conductor coated therewith

Apparatus for fluidized bed-electrostatic coating of indefinite length substrate

Method and apparatus for fabricating a metal interconnection pattern for an integrated circuit module

MARTIN MARIETTA CORP

Structure for protecting air bridges on semiconductor chips from damage

Fabrication and structures of circuit modules with flexible interconnect layers

Wafer level integration and testing

Method for protecting gallium arsenide mmic air bridge structures

Structure for protecting air bridges on semiconductor chips from damage

Method for enhancement of semiconductor device contact pads

Process for high density interconnection of substrates and integrated circuit chips containing sensitive structures