P

Inventor

SHA JING

US19 patents
⚠️ This page may combine multiple inventors who share the name “SHA JING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

18 patents
US11301748B2Apr 12, 2022

Automatic feature extraction from aerial images for test pattern sampling and pattern coverage inspection for lithography

IBM11 citations85
US10831976B1Nov 10, 2020

Predicting local layout effects in circuit design patterns

IBM11 citations85
US10539881B1Jan 21, 2020

Generation of hotspot-containing physical design layout patterns

IBM15 citations85
US10706200B2Jul 7, 2020

Generative adversarial networks for generating physical design layout patterns of integrated multi-layers

IBM9 citations84
US10699055B2Jun 30, 2020

Generative adversarial networks for generating physical design layout patterns

IBM9 citations84
US10621302B2Apr 14, 2020

Classification and localization of hotspots in integrated physical design layouts

IBM9 citations84
US10599807B2Mar 24, 2020

Automatic generation of via patterns with coordinate-based recurrent neural network (RNN)

IBM5 citations84
US11189566B2Nov 30, 2021

Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias

IBM2 citations73
US10990747B2Apr 27, 2021

Automatic generation of via patterns with coordinate-based recurrent neural network (RNN)

IBM2 citations73
US10706205B2Jul 7, 2020

Detecting hotspots in physical design layout patterns utilizing hotspot detection model with data augmentation

IBM3 citations73
US10621301B2Apr 14, 2020

Coordinates-based variational autoencoder for generating synthetic via layout patterns

IBM3 citations73
US10606975B2Mar 31, 2020

Coordinates-based generative adversarial networks for generating synthetic physical design layout patterns

IBM6 citations73
US10592635B2Mar 17, 2020

Generating synthetic layout patterns by feedforward neural network based variational autoencoders

IBM5 citations73
US10579764B2Mar 3, 2020

Co-modeling post-lithography critical dimensions and post-etch critical dimensions with multi-task neural networks

IBM3 citations72
US10621295B2Apr 14, 2020

Incorporation of process variation contours in design rule and risk estimation aspects of design for manufacturability to increase fabrication yield

IBM1 citations61
US10657420B2May 19, 2020

Modeling post-lithography stochastic critical dimension variation with multi-task neural networks

IBM0 citations41
US10768532B2Sep 8, 2020

Co-optimization of lithographic and etching processes with complementary post exposure bake by laser annealing

IBM0 citations39
US10678971B2Jun 9, 2020

Space exploration with Bayesian inference

IBM0 citations38

Sino Lion USA LLC

1 patent