Inventor

OH KI-TAIK

KR2 patents

Patents

2 patents

US8672210B2Mar 18, 2014

Capillary exchange system of semiconductor wire bonding

SAMSUNG ELECTRONICS CO LTD12 citations80

US7841505B2Nov 30, 2010

Wire clamp and wire bonding apparatus having the same

SAMSUNG ELECTRONICS CO LTD3 citations60