Inventor
LO HSIEN-CHING
US31 patents
⚠️ This page may combine multiple inventors who share the name “LO HSIEN-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
25 patentsUS10249538B1Apr 2, 2019
Method of forming vertical field effect transistors with different gate lengths and a resulting structure
GLOBALFOUNDRIES INC22 citations94
US10163635B1Dec 25, 2018
Asymmetric spacer for preventing epitaxial merge between adjacent devices of a semiconductor and related method
GLOBALFOUNDRIES INC26 citations94
US9419101B1Aug 16, 2016
Multi-layer spacer used in finFET
GLOBALFOUNDRIES INC20 citations91
US10068810B1Sep 4, 2018
Multiple Fin heights with dielectric isolation
GLOBALFOUNDRIES INC9 citations84
US9947769B1Apr 17, 2018
Multiple-layer spacers for field-effect transistors
GLOBALFOUNDRIES INC14 citations84
US9887094B1Feb 6, 2018
Methods of forming EPI semiconductor material on the source/drain regions of a FinFET device
GLOBALFOUNDRIES INC14 citations84
US10388652B2Aug 20, 2019
Intergrated circuit structure including single diffusion break abutting end isolation region, and methods of forming same
GLOBALFOUNDRIES INC10 citations83
US10559656B2Feb 11, 2020
Wrap-all-around contact for nanosheet-FET and method of forming same
GLOBALFOUNDRIES INC8 citations82
US10068902B1Sep 4, 2018
Integrated circuit structure incorporating non-planar field effect transistors with different channel region heights and method
GLOBALFOUNDRIES INC4 citations73
US10050125B1Aug 14, 2018
Vertical-transport field-effect transistors with an etched-through source/drain cavity
GLOBALFOUNDRIES INC6 citations73
US10553707B1Feb 4, 2020
FinFETs having gates parallel to fins
GLOBALFOUNDRIES INC5 citations71
US10410929B2Sep 10, 2019
Multiple gate length device with self-aligned top junction
GLOBALFOUNDRIES INC1 citations62
US10276689B2Apr 30, 2019
Method of forming a vertical field effect transistor (VFET) and a VFET structure
GLOBALFOUNDRIES INC1 citations62
US10262903B2Apr 16, 2019
Boundary spacer structure and integration
GLOBALFOUNDRIES INC1 citations62
US10211317B1Feb 19, 2019
Vertical-transport field-effect transistors with an etched-through source/drain cavity
GLOBALFOUNDRIES INC1 citations62
US10297675B1May 21, 2019
Dual-curvature cavity for epitaxial semiconductor growth
GLOBALFOUNDRIES INC1 citations58
US10714577B2Jul 14, 2020
Etch stop layer for use in forming contacts that extend to multiple depths
GLOBALFOUNDRIES INC0 citations52
US10431665B2Oct 1, 2019
Multiple-layer spacers for field-effect transistors
GLOBALFOUNDRIES INC0 citations52
US10121868B1Nov 6, 2018
Methods of forming epi semiconductor material on a thinned fin in the source/drain regions of a FinFET device
GLOBALFOUNDRIES INC1 citations52
US10700173B2Jun 30, 2020
FinFET device with a wrap-around silicide source/drain contact structure
GLOBALFOUNDRIES INC0 citations51
US10636894B2Apr 28, 2020
Fin-type transistors with spacers on the gates
GLOBALFOUNDRIES INC0 citations51
US10546775B1Jan 28, 2020
Field-effect transistors with improved dielectric gap fill
GLOBALFOUNDRIES INC0 citations51
US10355104B2Jul 16, 2019
Single-curvature cavity for semiconductor epitaxy
GLOBALFOUNDRIES INC0 citations49
US10164010B1Dec 25, 2018
Finfet diffusion break having protective liner in fin insulator
GLOBALFOUNDRIES INC0 citations40
US10461155B2Oct 29, 2019
Epitaxial region for embedded source/drain region having uniform thickness
GLOBALFOUNDRIES INC0 citations35