P

Inventor

LO HSIEN-CHING

US31 patents
⚠️ This page may combine multiple inventors who share the name “LO HSIEN-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBALFOUNDRIES INC

25 patents
US10249538B1Apr 2, 2019

Method of forming vertical field effect transistors with different gate lengths and a resulting structure

GLOBALFOUNDRIES INC22 citations94
US10163635B1Dec 25, 2018

Asymmetric spacer for preventing epitaxial merge between adjacent devices of a semiconductor and related method

GLOBALFOUNDRIES INC26 citations94
US9419101B1Aug 16, 2016

Multi-layer spacer used in finFET

GLOBALFOUNDRIES INC20 citations91
US10068810B1Sep 4, 2018

Multiple Fin heights with dielectric isolation

GLOBALFOUNDRIES INC9 citations84
US9947769B1Apr 17, 2018

Multiple-layer spacers for field-effect transistors

GLOBALFOUNDRIES INC14 citations84
US9887094B1Feb 6, 2018

Methods of forming EPI semiconductor material on the source/drain regions of a FinFET device

GLOBALFOUNDRIES INC14 citations84
US10388652B2Aug 20, 2019

Intergrated circuit structure including single diffusion break abutting end isolation region, and methods of forming same

GLOBALFOUNDRIES INC10 citations83
US10559656B2Feb 11, 2020

Wrap-all-around contact for nanosheet-FET and method of forming same

GLOBALFOUNDRIES INC8 citations82
US10068902B1Sep 4, 2018

Integrated circuit structure incorporating non-planar field effect transistors with different channel region heights and method

GLOBALFOUNDRIES INC4 citations73
US10050125B1Aug 14, 2018

Vertical-transport field-effect transistors with an etched-through source/drain cavity

GLOBALFOUNDRIES INC6 citations73
US10553707B1Feb 4, 2020

FinFETs having gates parallel to fins

GLOBALFOUNDRIES INC5 citations71
US10410929B2Sep 10, 2019

Multiple gate length device with self-aligned top junction

GLOBALFOUNDRIES INC1 citations62
US10276689B2Apr 30, 2019

Method of forming a vertical field effect transistor (VFET) and a VFET structure

GLOBALFOUNDRIES INC1 citations62
US10262903B2Apr 16, 2019

Boundary spacer structure and integration

GLOBALFOUNDRIES INC1 citations62
US10211317B1Feb 19, 2019

Vertical-transport field-effect transistors with an etched-through source/drain cavity

GLOBALFOUNDRIES INC1 citations62
US10297675B1May 21, 2019

Dual-curvature cavity for epitaxial semiconductor growth

GLOBALFOUNDRIES INC1 citations58
US10714577B2Jul 14, 2020

Etch stop layer for use in forming contacts that extend to multiple depths

GLOBALFOUNDRIES INC0 citations52
US10431665B2Oct 1, 2019

Multiple-layer spacers for field-effect transistors

GLOBALFOUNDRIES INC0 citations52
US10121868B1Nov 6, 2018

Methods of forming epi semiconductor material on a thinned fin in the source/drain regions of a FinFET device

GLOBALFOUNDRIES INC1 citations52
US10700173B2Jun 30, 2020

FinFET device with a wrap-around silicide source/drain contact structure

GLOBALFOUNDRIES INC0 citations51
US10636894B2Apr 28, 2020

Fin-type transistors with spacers on the gates

GLOBALFOUNDRIES INC0 citations51
US10546775B1Jan 28, 2020

Field-effect transistors with improved dielectric gap fill

GLOBALFOUNDRIES INC0 citations51
US10355104B2Jul 16, 2019

Single-curvature cavity for semiconductor epitaxy

GLOBALFOUNDRIES INC0 citations49
US10164010B1Dec 25, 2018

Finfet diffusion break having protective liner in fin insulator

GLOBALFOUNDRIES INC0 citations40
US10461155B2Oct 29, 2019

Epitaxial region for embedded source/drain region having uniform thickness

GLOBALFOUNDRIES INC0 citations35

TAIWAN SEMICONDUCTOR MFG

2 patents

FUNG KA-HING

1 patent

GLOBALFOUNDRIES US INC

1 patent

CHENG CHUN-FAI

1 patent

HING FUNG KA

1 patent