Inventor

LI KUO-WEI

TW5 patents

⚠️ This page may combine multiple inventors who share the name “LI KUO-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNIMICRON TECHNOLOGY CORP

2 patents

US11600936B2Mar 7, 2023

Circuit board structure

UNIMICRON TECHNOLOGY CORP0 citations60

US11114782B2Sep 7, 2021

Method of manufacturing circuit board structure

UNIMICRON TECHNOLOGY CORP0 citations60

MORTECH CORP

2 patents

US9499664B2Nov 22, 2016

Polyimide polymer, polyimide film having the same and polyimide laminate having the same

MORTECH CORP0 citations42

US9234085B2Jan 12, 2016

Polyimide film and polyimide laminate thereof

MORTECH CORP1 citations42

TAIWAN SEMICONDUCTOR MFG

1 patent

US7816169B2Oct 19, 2010

Colors only process to reduce package yield loss

TAIWAN SEMICONDUCTOR MFG5 citations73