Inventor

NA MIN-OK

KR13 patents

⚠️ This page may combine multiple inventors who share the name “NA MIN-OK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

8 patents

US8829686B2Sep 9, 2014

Package-on-package assembly including adhesive containment element

SAMSUNG ELECTRONICS CO LTD24 citations91

US9040351B2May 26, 2015

Stack packages having fastening element and halogen-free inter-package connector

SAMSUNG ELECTRONICS CO LTD4 citations72

US10950521B2Mar 16, 2021

Thermal interface material layer and package-on-package device including the same

SAMSUNG ELECTRONICS CO LTD0 citations61

US10593652B2Mar 17, 2020

Stacked semiconductor packages

SAMSUNG ELECTRONICS CO LTD0 citations52

US10403606B2Sep 3, 2019

Method of fabricating a semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations52

US9978721B2May 22, 2018

Apparatus for stacked semiconductor packages and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations52

US10431522B2Oct 1, 2019

Thermal interface material layer and package-on-package device including the same

SAMSUNG ELECTRONICS CO LTD0 citations50

US9214484B2Dec 15, 2015

Image sensor packages

SAMSUNG ELECTRONICS CO LTD0 citations48

KWON HEUNG-KYU

2 patents

US8508954B2Aug 13, 2013

Systems employing a stacked semiconductor package

KWON HEUNG-KYU60 citations97

US9042115B2May 26, 2015

Stacked semiconductor packages

KWON HEUNG-KYU4 citations84

PARK JI-HYUN

2 patents

US8426959B2Apr 23, 2013

Semiconductor package and method of manufacturing the same

PARK JI-HYUN5 citations83

US8709879B2Apr 29, 2014

Method of forming a semiconductor package

PARK JI-HYUN4 citations72

NA MIN OK

1 patent

US9899294B2Feb 20, 2018

Thermal interface material layer and package-on-package device including the same

NA MIN OK2 citations65