Inventor · disambiguated record
Seung Yeop Kook
Also filed as: KOOK SEUNG YEOP
21 granted patents·15 pending applications·37 citations·filing 2011–2023
92Inventor score
Top patents by PatentIndex Score
36 records- 0195US10062652B2Fan-out semiconductor package and method of manufacturing sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 28, 2018·12 cites·18 claims
- 0293US10128179B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 13, 2018·8 cites·33 claims
- 0386US10388614B2Fan-out semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 20, 2019·4 cites·18 claims
- 0481US12300594B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 13, 2025·0 cites·19 claims
- 0579US10477683B2Printed circuit board including sub-circuit boardSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 12, 2019·2 cites·21 claims
- 0677US10461008B2Electronic component package having stress alleviation structureSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 29, 2019·3 cites·20 claims
- 0775US10446481B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 15, 2019·1 cites·20 claims
- 0874US10115648B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 30, 2018·2 cites·22 claims
- 0973US9420709B2Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 16, 2016·3 cites·20 claims
- 1072US11626364B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·18 claims
- 1172US10861784B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 8, 2020·0 cites·20 claims
- 1266US9859243B2Electronic component package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 2, 2018·1 cites·6 claims
- 1365US10679933B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 9, 2020·0 cites·23 claims
- 1465US10270948B2Substrate for camera module and camera module having the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Apr 23, 2019·1 cites·5 claims
- 1559US10701806B2Printed circuit board including sub-circuit boardSAMSUNG ELECTRO MECH·Filed 2019·Granted Jun 30, 2020·0 cites·18 claims
- 1653US9929117B2Electronic component package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Mar 27, 2018·0 cites·15 claims
- 1752US11699650B2Integrated circuit structure with capacitor electrodes in different ILD layers, and related methodsGLOBALFOUNDRIES US INC·Filed 2021·Granted Jul 11, 2023·0 cites·19 claims
- 1852US11348867B2Capacitor structure for integrated circuit and related methodsGLOBALFOUNDRIES US INC·Filed 2020·Granted May 31, 2022·0 cites·16 claims
- 1951US2015195905A1Package board, method of manufacturing the same, and semiconductor package using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2050US11107880B2Capacitor structure for integrated circuit, and related methodsGLOBALFOUNDRIES US INC·Filed 2019·Granted Aug 31, 2021·0 cites·20 claims
- 2149US2015156891A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2249US2014151095A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2348US9839126B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Dec 5, 2017·0 cites·6 claims
- 2446US2015364539A1Package board and package using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2545US2015351228A1Package board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2644US2015179594A1Package substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2744US2012047696A1Clamp for board clampingJUNG BYUNG WUL·Filed 2011·Application pending·0 cites
- 2841US9832885B2Circuit board, electronic component and method of manufacturing circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Granted Nov 28, 2017·0 cites·10 claims
- 2935US2015366059A1Circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3035US2016302308A1Printed circuit board, electronic component module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3135US2016050752A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3234US2015364407A1Package board and package using the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3333US2015348918A1Package substrate, package, package on package and manufacturing method of package substrateSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3433US2016007467A1Package structure and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3533US2015351247A1Package board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3632US2015351231A1Circuit board and method of manufacturing circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →