Inventor

KARASAWA YASUNORI

JP4 patents

⚠️ This page may combine multiple inventors who share the name “KARASAWA YASUNORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LINTEC CORP

2 patents

US11512200B2Nov 29, 2022

Resin composition, resin sheet, laminate, and semiconductor element

LINTEC CORP0 citations54

US12247124B2Mar 11, 2025

Resin sheet

LINTEC CORP0 citations48

KARASAWA YASUNORI

2 patents

US8445092B2May 21, 2013

Resin sheet for circuit boards, sheet for circuit boards and circuit board displays

KARASAWA YASUNORI2 citations54

US8716401B2May 6, 2014

Semiconductor chip laminate and adhesive composition for semiconductor chip lamination

KARASAWA YASUNORI1 citations44