Inventor
BURGESS CONNOR
US7 patents
Patents
7 patentsUS11990386B2May 21, 2024
Methods and heat distribution devices for thermal management of chip assemblies
GOOGLE LLC1 citations71
US11488890B2Nov 1, 2022
Direct liquid cooling with O-ring sealing
GOOGLE LLC2 citations71
US12588510B2Mar 24, 2026
Weight optimized stiffener and sealing structure for direct liquid cooled modules
GOOGLE LLC0 citations61
US11721641B2Aug 8, 2023
Weight optimized stiffener and sealing structure for direct liquid cooled modules
GOOGLE LLC0 citations61
US12272619B2Apr 8, 2025
Direct liquid cooling with O-ring sealing
GOOGLE LLC0 citations60
US12243802B2Mar 4, 2025
Methods and heat distribution devices for thermal management of chip assemblies
GOOGLE LLC0 citations60
US12315782B2May 27, 2025
Spring loaded compliant coolant distribution manifold for direct liquid cooled modules
GOOGLE LLC0 citations50