Inventor
JAIN PADAM
US13 patents
⚠️ This page may combine multiple inventors who share the name “JAIN PADAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GOOGLE LLC
11 patentsUS11990386B2May 21, 2024
Methods and heat distribution devices for thermal management of chip assemblies
GOOGLE LLC1 citations71
US11488890B2Nov 1, 2022
Direct liquid cooling with O-ring sealing
GOOGLE LLC2 citations71
US10964625B2Mar 30, 2021
Device and method for direct liquid cooling via metal channels
GOOGLE LLC3 citations71
US12588510B2Mar 24, 2026
Weight optimized stiffener and sealing structure for direct liquid cooled modules
GOOGLE LLC0 citations61
US11721641B2Aug 8, 2023
Weight optimized stiffener and sealing structure for direct liquid cooled modules
GOOGLE LLC0 citations61
US12272619B2Apr 8, 2025
Direct liquid cooling with O-ring sealing
GOOGLE LLC0 citations60
US12243802B2Mar 4, 2025
Methods and heat distribution devices for thermal management of chip assemblies
GOOGLE LLC0 citations60
US11955406B2Apr 9, 2024
Temperature control element utilized in device die packages
GOOGLE LLC0 citations59
US12568821B2Mar 3, 2026
Pin fin placement assembly for forming temperature control element utilized in device die packages
GOOGLE LLC0 citations58
US12424509B2Sep 23, 2025
Compliant pad spacer for three-dimensional integrated circuit package
GOOGLE LLC0 citations54
US12315782B2May 27, 2025
Spring loaded compliant coolant distribution manifold for direct liquid cooled modules
GOOGLE LLC0 citations50