Inventor · disambiguated record
Kang-Wook Lee
Also filed as: LEE KANG-WOOK
90 granted patents·15 pending applications·1,974 citations·filing 1991–2022
99Inventor score
Top patents by PatentIndex Score
105 records- 0199US7276799B2Chip stack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 2, 2007·429 cites·10 claims
- 0299US7215033B2Wafer level stack structure for system-in-package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 8, 2007·422 cites·11 claims
- 0397US7537959B2Chip stack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 26, 2009·52 cites·10 claims
- 0497US7151009B2Method for manufacturing wafer level chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 19, 2006·356 cites·20 claims
- 0595USD979624SIndustrial robotHANWHA CORP·Filed 2021·Granted Feb 28, 2023·27 cites·1 claims
- 0695US8368231B2Chipstack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Feb 5, 2013·12 cites·19 claims
- 0795US7262475B2Image sensor device and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 28, 2007·30 cites·8 claims
- 0891US6455443B1Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect densityIBM·Filed 2001·Granted Sep 24, 2002·60 cites·22 claims
- 0991US5582858AAdhesive layer in multi-level packaging and organic material as a metal diffusion barrierIBM·Filed 1995·Granted Dec 10, 1996·113 cites·14 claims
- 1089US7777323B2Semiconductor structure and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 17, 2010·19 cites·22 claims
- 1189US7588964B2Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 15, 2009·18 cites·13 claims
- 1288US9754921B2Stacked semiconductor apparatus, system and method of fabricationPARK KI-TAE·Filed 2015·Granted Sep 5, 2017·5 cites·8 claims
- 1387US7977156B2Chipstack package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jul 12, 2011·11 cites·20 claims
- 1487US7666690B2System, apparatus and method of selective laser repair for metal bumps of semiconductor device stackSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 23, 2010·8 cites·8 claims
- 1587US7459774B2Stacked chip package using photosensitive polymer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 2, 2008·23 cites·13 claims
- 1687US5326643AAdhesive layer in multi-level packaging and organic material as a metal diffusion barrierIBM·Filed 1991·Granted Jul 5, 1994·41 cites·31 claims
- 1783US10687760B2Combined wearable electrocardiogram and electronic stethoscopeIBM·Filed 2018·Granted Jun 23, 2020·3 cites·20 claims
- 1883US7119425B2Stacked multi-chip semiconductor package improving connection reliability of stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 10, 2006·12 cites·24 claims
- 1982US9818717B2Enhanced cleaning for water-soluble flux solderingIBM·Filed 2016·Granted Nov 14, 2017·2 cites·13 claims
- 2081US8659163B2Semiconductor device having through electrode and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Feb 25, 2014·4 cites·20 claims
- 2181US7875552B2Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 25, 2011·7 cites·5 claims
- 2280US6784485B1Diffusion barrier layer and semiconductor device containing sameIBM·Filed 2000·Granted Aug 31, 2004·25 cites·15 claims
- 2380US5786041AAlignment film, a method for producing the alignment film and a liquid crystal display device using the alignment filmIBM·Filed 1995·Granted Jul 28, 1998·65 cites·17 claims
- 2478USRE45781EToughness, adhesion and smooth metal lines of porous low K dielectric interconnect structuresHEDRICK JEFFREY C·Filed 2014·Granted Oct 27, 2015·4 cites·65 claims
- 2578US7786594B2Wafer level stack structure for system-in-package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 31, 2010·5 cites·25 claims
- 2677US8278766B2Wafer level stack structure for system-in-package and method thereofLEE KANG-WOOK·Filed 2010·Granted Oct 2, 2012·3 cites·16 claims
- 2776US10448830B2Wearable blood pressure monitoring systemIBM·Filed 2016·Granted Oct 22, 2019·2 cites·17 claims
- 2876US6783862B2Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structuresIBM·Filed 2002·Granted Aug 31, 2004·12 cites·51 claims
- 2975US11259712B2Wearable reflectance-mode PPG sensor network having improved detected signal strengthIBM·Filed 2018·Granted Mar 1, 2022·2 cites·20 claims
- 3075US10876777B2Air conditioning device using vapor injection cycle and method for controlling the deviceLG ELECTRONICS INC·Filed 2018·Granted Dec 29, 2020·2 cites·4 claims
- 3175US10098611B2Wearable and non-wearable electronic stethoscopes and use of the digitized acoustic data for data analytics and healthcareIBM·Filed 2015·Granted Oct 16, 2018·2 cites·18 claims
- 3275US8629059B2Methods of forming integrated circuit chips having vertically extended through-substrate vias thereinLEE HO-JIN·Filed 2010·Granted Jan 14, 2014·3 cites·18 claims
- 3374US7740713B2Flux composition and techniques for use thereofIBM·Filed 2004·Granted Jun 22, 2010·17 cites·30 claims
- 3474US6933586B2Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogensIBM·Filed 2002·Granted Aug 23, 2005·11 cites·25 claims
- 3574US5599582AAdhesive layer in multi-level packaging and organic material as a metal diffusion barrierIBM·Filed 1995·Granted Feb 4, 1997·25 cites·10 claims
- 3673US10621885B2Wearable sensor monitoring and data analysisIBM·Filed 2015·Granted Apr 14, 2020·2 cites·16 claims
- 3771US7824959B2Wafer level stack structure for system-in-package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 2, 2010·3 cites·13 claims
- 3871US7780801B2Flux composition and process for use thereofIBM·Filed 2006·Granted Aug 24, 2010·5 cites·7 claims
- 3971US7534656B2Image sensor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 19, 2009·2 cites·12 claims
- 4069US10531797B2Wearable blood pressure monitoring systemIBM·Filed 2016·Granted Jan 14, 2020·1 cites·22 claims
- 4169US6632536B2Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displaysIBM·Filed 2000·Granted Oct 14, 2003·9 cites·13 claims
- 4268US12064219B2Determining blood pulse characteristics based on stethoscope dataIBM·Filed 2020·Granted Aug 20, 2024·0 cites·11 claims
- 4368US10612501B2Vehicular resonatorLS MTRON LTD·Filed 2016·Granted Apr 7, 2020·1 cites·9 claims
- 4467US10485430B2Layered and multi-sectional pulse wave sensors and use thereofIBM·Filed 2015·Granted Nov 26, 2019·1 cites·25 claims
- 4567US7524763B2Fabrication method of wafer level chip scale packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 28, 2009·4 cites·12 claims
- 4666US10019199B2Controller coupled to semiconductor memory device and operating method thereofSK HYNIX INC·Filed 2016·Granted Jul 10, 2018·1 cites·17 claims
- 4766US9579738B2Flux composition and techniques for use thereofLEE KANG-WOOK·Filed 2011·Granted Feb 28, 2017·1 cites·7 claims
- 4866US8004848B2Stack module, card including the stack module, and system including the stack moduleSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 23, 2011·3 cites·23 claims
- 4965US12428868B2Hard rooftop tentLEE YOO KYEONG·Filed 2022·Granted Sep 30, 2025·1 cites·15 claims
- 5065US9815149B2Flux composition and techniques for use thereofLEE KANG-WOOK·Filed 2012·Granted Nov 14, 2017·1 cites·5 claims
Showing the top 50 of 105 patent records by PatentIndex Score.
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