Inventor · disambiguated record
Pedro A. Chalco
Also filed as: CHALCO PEDRO · CHALCO PEDRO A · CHALCO PEDRO ARMENGO
17 granted patents·1 pending application·601 citations·filing 1988–2001
95Inventor score
Files withIBM17
Top patents by PatentIndex Score
18 records- 0193US5298715ALasersonic soldering of fine insulated wires to heat-sensitive substratesIBM·Filed 1992·Granted Mar 29, 1994·129 cites·14 claims
- 0284US5826328AMethod of making a thin radio frequency transponderIBM·Filed 1996·Granted Oct 27, 1998·79 cites·27 claims
- 0383US5565119AMethod and apparatus for soldering with a multiple tip and associated optical fiber heating deviceIBM·Filed 1995·Granted Oct 15, 1996·61 cites·15 claims
- 0483US4970365AMethod and apparatus for bonding components leads to pads located on a non-rigid substrateIBM·Filed 1990·Granted Nov 13, 1990·80 cites·68 claims
- 0582US4894509ALaser assisted heater bar for multiple lead attachmentIBM·Filed 1988·Granted Jan 16, 1990·35 cites·19 claims
- 0678US6697037B1TFT LCD active data line repairIBM·Filed 1996·Granted Feb 24, 2004·56 cites·14 claims
- 0771US5079070ARepair of open defects in thin film conductorsIBM·Filed 1990·Granted Jan 7, 1992·31 cites·21 claims
- 0870US6130479ANickel alloy films for reduced intermetallic formation in solderIBM·Filed 1999·Granted Oct 10, 2000·25 cites·8 claims
- 0967US5948286ADiffusion bonding of lead interconnections using precise laser-thermosonic energyIBM·Filed 1997·Granted Sep 7, 1999·34 cites·3 claims
- 1052US6444562B1Nickel alloy films for reduced intermetallic formation in solderIBM·Filed 2000·Granted Sep 3, 2002·3 cites·7 claims
- 1151US5154022AHigh precision micromachining of very fine featuresIBM·Filed 1991·Granted Oct 13, 1992·15 cites·21 claims
- 1248US5281025ATemperature sensing device for dynamically measuring temperature fluctuation in a tip of a bonding deviceIBM·Filed 1993·Granted Jan 25, 1994·16 cites·27 claims
- 1347US5289632AApplying conductive lines to integrated circuitsIBM·Filed 1992·Granted Mar 1, 1994·12 cites·27 claims
- 1446US5457299ASemiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chipIBM·Filed 1993·Granted Oct 10, 1995·17 cites·8 claims
- 1535US6029881AMicro-scale part positioning by surface interlockingIBM·Filed 1997·Granted Feb 29, 2000·4 cites·16 claims
- 1635US2002092895A1Formation of a solder joint having a transient liquid phase by annealing and quenchingFiled 2001·Application pending·0 cites
- 1732US5310967AApplying conductive lines to integrated circuitsIBM·Filed 1993·Granted May 10, 1994·3 cites·10 claims
- 1829US5321886AApplying conductive lines to integrated circuitsIBM·Filed 1993·Granted Jun 21, 1994·1 cites·19 claims
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