Inventor
MILKOVICH CYNTHIA S
US11 patents
Patents
11 patentsUS5729896AMar 24, 1998
Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder
IBM185 citations98
US6100114AAug 8, 2000
Encapsulation of solder bumps and solder connections
IBM54 citations96
US5759269AJun 2, 1998
Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture
IBM41 citations95
US5638597AJun 17, 1997
Manufacturing flexible circuit board assemblies with common heat spreaders
IBM42 citations95
US6955982B2Oct 18, 2005
Flip chip C4 extension structure and process
IBM29 citations92
US6756680B2Jun 29, 2004
Flip chip C4 extension structure and process
IBM33 citations92
US6486415B2Nov 26, 2002
Compliant layer for encapsulated columns
IBM20 citations92
US5969945AOct 19, 1999
Electronic package assembly
IBM33 citations91
US5831828ANov 3, 1998
Flexible circuit board and common heat spreader assembly
IBM32 citations91
US7278207B2Oct 9, 2007
Method of making an electronic package
IBM1 citations62
US6961995B2Nov 8, 2005
Method of making an electronic package
IBM3 citations62