Inventor
ABE YUGAKU
JP13 patents
⚠️ This page may combine multiple inventors who share the name “ABE YUGAKU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMITOMO ELECTRIC INDUSTRIES
10 patentsUS6388273B1May 14, 2002
Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
SUMITOMO ELECTRIC INDUSTRIES21 citations92
US6183874B1Feb 6, 2001
Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
SUMITOMO ELECTRIC INDUSTRIES28 citations92
US5448107ASep 5, 1995
Radiating fin having an improved life and thermal conductivity
SUMITOMO ELECTRIC INDUSTRIES35 citations92
US6737168B1May 18, 2004
Composite material and semiconductor device using the same
SUMITOMO ELECTRIC INDUSTRIES19 citations91
US6534190B1Mar 18, 2003
Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
SUMITOMO ELECTRIC INDUSTRIES9 citations73
US7180178B2Feb 20, 2007
Semiconductor heat-dissipating substrate, and manufacturing method and package therefor
SUMITOMO ELECTRIC INDUSTRIES7 citations72
US5605558AFeb 25, 1997
Nitrogenous aluminum-silicon powder metallurgical alloy
SUMITOMO ELECTRIC INDUSTRIES3 citations62
US5132779AJul 21, 1992
Housing for semiconductor device with occlusion gas removed
SUMITOMO ELECTRIC INDUSTRIES3 citations62
US6979901B2Dec 27, 2005
Semiconductor heat-dissipating substrate, and manufacturing method and package therefor
SUMITOMO ELECTRIC INDUSTRIES1 citations51
US5275782AJan 4, 1994
Housing for semiconductor device
SUMITOMO ELECTRIC INDUSTRIES1 citations45