Inventor

FUKUI AKIRA

JP39 patents

⚠️ This page may combine multiple inventors who share the name “FUKUI AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUKUI AKIRA

SUMITOMO ELECTRIC INDUSTRIES

Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

Silicon carbide based composite material and manufacturing method thereof

Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

Composite material and semiconductor device using the same

Member for semiconductor device and method for producing the same

Aluminum base member for semiconductor device containing a nitrogen rich surface and method for producing the same

Electric contact materials

Aluminum-silicon carbide semiconductor substrate and method for producing the same

Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

Heat-dissipating substrate, method for making the same, and semiconductor device including the same

Plate type member for semiconductor device package and package

SONY CORP

Information processing apparatus and information processing method

Information processing device, method of processing information, and method of providing information

Information processing method and information processing device

Information processing device and method

Information processing device, method of processing information, and method of providing information

Information processing device and information processing method

Information processing device, method of processing information, and method of providing information

SONY GROUP CORP

Information processing device to stop the turn off of power based on voice input for voice operation

Information processing device and information processing method

Information processing device, information processing system and information processing method

NEC CORP

Method and apparatus for speech coding

Method and apparatus for multi-pulse speech coding

MITSUBISHI HITACHI POWER SYS

Condenser

Condenser, multistage pressure condenser provided therewith, and reheating module used in condenser

KAIJO KK

Chemical concentration control device for semiconductor processing apparatus

Substrate processing apparatus and substrate transporting device mounted thereto

FUKUI AKIRA

Inkjet dyeing method

Inkjet dyeing apparatus

SUPERUFO291 TEC

Bonding member for semiconductor device

Heat dissipation substrate and method for producing heat dissipation substrate

CANON APTEX INC

Sheet bundle folding apparatus

KOKUSAI DENSHIN DENWA CO LTD

Audio frequency signal identification apparatus

ALMT CORP

Member for semiconductor device and production method thereof

SUMOTOMO ELECTRIC IND LTD

Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

ALPS ALPINE CO LTD

Current sensor and electric device

SANWA KAGAKU KENKYUSHO CO

2,5-Benzodiazocine derivatives and salts thereof, as well as pharmaceutical agent comprising as effective component at least one of the derivatives and salts

SUMCO CORP

Method of producing epitaxial wafer

OMACHI MASAHIRO

Heat sink substrate and production method for the same