Inventor
KOYAMA KAZUHIDE
JP14 patents
⚠️ This page may combine multiple inventors who share the name “KOYAMA KAZUHIDE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
13 patentsUS5981377ANov 9, 1999
Semiconductor device with improved trench interconnected to connection plug mating and method of making same
SONY CORP54 citations95
US5290731AMar 1, 1994
Aluminum metallization method
SONY CORP73 citations95
US6043145AMar 28, 2000
Method for making multilayer wiring structure
SONY CORP66 citations94
US6093654AJul 25, 2000
Process for forming interconnection of semiconductor device and sputtering system therefor
SONY CORP20 citations92
US5985751ANov 16, 1999
Process for fabricating interconnection of semiconductor device
SONY CORP29 citations92
US5864179AJan 26, 1999
Aluminum like metal wiring for semiconductor devices
SONY CORP41 citations92
US5776830AJul 7, 1998
Process for fabricating connection structures
SONY CORP22 citations92
US6908820B2Jun 21, 2005
Method of manufacturing semiconductor device
SONY CORP12 citations83
US7220645B2May 22, 2007
Method of manufacturing semiconductor device
SONY CORP5 citations73
US6197686B1Mar 6, 2001
Aluminum metallization by a barrier metal process
SONY CORP11 citations73
US5272110ADec 21, 1993
Method of forming wirings
SONY CORP7 citations73
US7056774B2Jun 6, 2006
Method of manufacturing semiconductor device
SONY CORP3 citations62
US6664165B2Dec 16, 2003
Semiconductor device and fabrication method therefor
SONY CORP4 citations62