Inventor
EDWARDS ROBERT D
US16 patents
⚠️ This page may combine multiple inventors who share the name “EDWARDS ROBERT D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS6383920B1May 7, 2002
Process of enclosing via for improved reliability in dual damascene interconnects
IBM179 citations98
US4969979ANov 13, 1990
Direct electroplating of through holes
IBM66 citations94
US9673089B2Jun 6, 2017
Interconnect structure with enhanced reliability
IBM2 citations73
US6086946AJul 11, 2000
Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby
IBM11 citations73
US5363553ANov 15, 1994
Method of drilling vias and through holes
IBM7 citations68
US8053257B2Nov 8, 2011
Method for prediction of premature dielectric breakdown in a semiconductor
IBM5 citations62
US7602265B2Oct 13, 2009
Apparatus for accurate and efficient quality and reliability evaluation of micro electromechanical systems
IBM2 citations62
US6383617B1May 7, 2002
Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby
IBM2 citations62
US9354252B2May 31, 2016
Pressure sensing and control for semiconductor wafer probing
IBM2 citations61
US9059111B2Jun 16, 2015
Reliable back-side-metal structure
IBM0 citations52
US9702930B2Jul 11, 2017
Semiconductor wafer probing system including pressure sensing and control unit
IBM0 citations51