Inventor
MAGNUSON ROY H
US31 patents
⚠️ This page may combine multiple inventors who share the name “MAGNUSON ROY H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
22 patentsUS5557844ASep 24, 1996
Method of preparing a printed circuit board
IBM138 citations99
US5487218AJan 30, 1996
Method for making printed circuit boards with selectivity filled plated through holes
IBM284 citations99
US6204453B1Mar 20, 2001
Two signal one power plane circuit board
IBM173 citations98
US6630743B2Oct 7, 2003
Copper plated PTH barrels and methods for fabricating
IBM53 citations96
US6750405B1Jun 15, 2004
Two signal one power plane circuit board
IBM19 citations92
US6201194B1Mar 13, 2001
Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric
IBM43 citations92
US5427895AJun 27, 1995
Semi-subtractive circuitization
IBM27 citations91
US4948707AAug 14, 1990
Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon
IBM52 citations91
US7566939B2Jul 28, 2009
Fabrication of silicon micro-mechanical structures
IBM10 citations84
US6852152B2Feb 8, 2005
Colloidal seed formulation for printed circuit board metallization
IBM12 citations84
US7353590B2Apr 8, 2008
Method of forming printed circuit card
IBM10 citations83
US4623554ANov 18, 1986
Method for controlling plating rate in an electroless plating system
IBM20 citations82
US4904506AFeb 27, 1990
Copper deposition from electroless plating bath
IBM19 citations79
US6949397B2Sep 27, 2005
Fabrication of silicon micro mechanical structures
IBM6 citations74
USRE37840ESep 17, 2002
Method of preparing a printed circuit board
IBM5 citations74
US6986198B2Jan 17, 2006
Method of forming printed circuit card
IBM6 citations73
US6495239B1Dec 17, 2002
Dielectric structure and method of formation
IBM13 citations73
US6228246B1May 8, 2001
Removal of metal skin from a copper-Invar-copper laminate
IBM7 citations73
US4684545AAug 4, 1987
Electroless plating with bi-level control of dissolved oxygen
IBM14 citations70
US6699350B2Mar 2, 2004
Dielectric structure and method of formation
IBM2 citations62
US4666858AMay 19, 1987
Determination of amount of anionic material in a liquid sample
IBM4 citations60
US4967690ANov 6, 1990
Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means
IBM3 citations59
ENDICOTT INTERCONNECT TECH INC
6 patentsUS7738249B2Jun 15, 2010
Circuitized substrate with internal cooling structure and electrical assembly utilizing same
ENDICOTT INTERCONNECT TECH INC32 citations93
US7541058B2Jun 2, 2009
Method of making circuitized substrate with internal optical pathway
ENDICOTT INTERCONNECT TECH INC20 citations93
US7713767B2May 11, 2010
Method of making circuitized substrate with internal optical pathway using photolithography
ENDICOTT INTERCONNECT TECH INC13 citations84
US7679005B2Mar 16, 2010
Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same
ENDICOTT INTERCONNECT TECH INC8 citations84
US7169313B2Jan 30, 2007
Plating method for circuitized substrates
ENDICOTT INTERCONNECT TECH INC13 citations83
US7635552B2Dec 22, 2009
Photoresist composition with antibacterial agent
ENDICOTT INTERCONNECT TECH INC0 citations47