Inventor
KIM GIL-BEAG
KR3 patents
Patents
3 patentsUS7291925B2Nov 6, 2007
Stack package using anisotropic conductive film (ACF) and method of making same
SAMSUNG ELECTRONICS CO LTD19 citations89
US7405105B2Jul 29, 2008
Stack package using anisotropic conductive film (ACF) and method of making same
SAMSUNG ELECTRONICS CO LTD4 citations59
US7288436B2Oct 30, 2007
Semiconductor chip package manufacturing method including screen printing process
SAMSUNG ELECTRONICS CO LTD0 citations48