Inventor

JUNG YONG-JIN

KR7 patents

⚠️ This page may combine multiple inventors who share the name “JUNG YONG-JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

3 patents

US7291925B2Nov 6, 2007

Stack package using anisotropic conductive film (ACF) and method of making same

SAMSUNG ELECTRONICS CO LTD19 citations89

US7405105B2Jul 29, 2008

Stack package using anisotropic conductive film (ACF) and method of making same

SAMSUNG ELECTRONICS CO LTD4 citations59

US7288436B2Oct 30, 2007

Semiconductor chip package manufacturing method including screen printing process

SAMSUNG ELECTRONICS CO LTD0 citations48

HYUNDAI MOTOR CO LTD

1 patent

US9110896B2Aug 18, 2015

Active air flap apparatus for vehicle and defect diagnosis method thereof

HYUNDAI MOTOR CO LTD14 citations83

JEONG HYECK-JIN

1 patent

US8937483B2Jan 20, 2015

Semiconductor package transferring apparatus and method of manufacturing semiconductor device using the same

JEONG HYECK-JIN7 citations73

KOREA INST ENERGY RES

1 patent

US10115943B2Oct 30, 2018

Battery packing module and battery pack

KOREA INST ENERGY RES2 citations67

SHIN HEE SUN

1 patent

US8692662B2Apr 8, 2014

Method of determining failure of active air flap

SHIN HEE SUN3 citations61