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Inventor
URBISH GLENN
US
3 patents
Patents
3 patents
US7176506B2
Feb 13, 2007
High frequency chip packages with connecting elements
TESSERA INC
320 citations
98
US7268426B2
Sep 11, 2007
High-frequency chip packages
TESSERA INC
56 citations
96
US7351641B2
Apr 1, 2008
Structure and method of forming capped chips
TESSERA INC
11 citations
83