Inventor

FREAR DARREL R

US13 patents

⚠️ This page may combine multiple inventors who share the name “FREAR DARREL R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FREESCALE SEMICONDUCTOR INC

4 patents

US7763976B2Jul 27, 2010

Integrated circuit module with integrated passive device

FREESCALE SEMICONDUCTOR INC38 citations92

US7981730B2Jul 19, 2011

Integrated conformal shielding method and process using redistributed chip packaging

FREESCALE SEMICONDUCTOR INC17 citations84

US7838420B2Nov 23, 2010

Method for forming a packaged semiconductor device

FREESCALE SEMICONDUCTOR INC10 citations84

US9598280B2Mar 21, 2017

Environmental sensor structure

FREESCALE SEMICONDUCTOR INC2 citations71

SANDIA CORP

2 patents

US5855323AJan 5, 1999

Method and apparatus for jetting, manufacturing and attaching uniform solder balls

SANDIA CORP50 citations90

US6064293AMay 16, 2000

Thermal fuse for high-temperature batteries

SANDIA CORP47 citations86

HOOPER STEPHEN R

2 patents

US9638597B2May 2, 2017

Differential pressure sensor assembly

HOOPER STEPHEN R6 citations67

US9510495B2Nov 29, 2016

Electronic devices with cavity-type, permeable material filled packages, and methods of their manufacture

HOOPER STEPHEN R1 citations48

MOTOROLA INC

1 patent

US6630725B1Oct 7, 2003

Electronic component and method of manufacture

MOTOROLA INC126 citations97

US ARMY

1 patent

US5300307AApr 5, 1994

Microstructure control of Al-Cu films for improved electromigration resistance

US ARMY29 citations88

WEN JIAN

1 patent

US8742555B2Jun 3, 2014

Lead frame having a flag with in-plane and out-of-plane mold locking features

WEN JIAN8 citations83

TRACHT NEIL T

1 patent

US8217511B2Jul 10, 2012

Redistributed chip packaging with thermal contact to device backside

TRACHT NEIL T7 citations76

BRAUCHLER FRED T

1 patent

US9466413B2Oct 11, 2016

Die-to-die inductive communication devices and methods

BRAUCHLER FRED T5 citations71