Inventor
KARHADE OMKAR
US49 patents
Patents
49 patentsUS11430724B2Aug 30, 2022
Ultra-thin, hyper-density semiconductor packages
INTEL CORP5 citations83
US12061371B2Aug 13, 2024
Patch on interposer architecture for low cost optical co-packaging
INTEL CORP2 citations73
US9685421B2Jun 20, 2017
Methods for high precision microelectronic die integration
INTEL CORP3 citations73
US9583470B2Feb 28, 2017
Electronic device with solder pads including projections
INTEL CORP3 citations73
US11676900B2Jun 13, 2023
Electronic assembly that includes a bridge
INTEL CORP2 citations72
US9795038B2Oct 17, 2017
Electronic package design that facilitates shipping the electronic package
INTEL CORP2 citations72
US9576942B1Feb 21, 2017
Integrated circuit assembly that includes stacked dice
INTEL CORP4 citations72
US11574851B2Feb 7, 2023
Coupled cooling fins in ultra-small systems
INTEL CORP3 citations70
US12599007B2Apr 7, 2026
Composite IC die package including an electro-thermo-mechanical die (ETMD) with through substrate vias
INTEL CORP0 citations62
US12525545B2Jan 13, 2026
HBI die fiducial architecture with cantilever fiducials for smaller die size and better yields
INTEL CORP0 citations62
US12506085B2Dec 23, 2025
HBI die architecture with fiducial in street for no metal depopulation in active die
INTEL CORP0 citations62
US12481108B2Nov 25, 2025
Faraday rotator interconnect as a through-via configuration in a patch architecture
INTEL CORP0 citations62
US12476174B2Nov 18, 2025
Ultra-thin, hyper-density semiconductor packages
INTEL CORP0 citations62
US12443058B2Oct 14, 2025
On-cavity photonic integrated circuit (OCPIC) to achieve the most undercut real estate for effective thermal tuning
INTEL CORP0 citations62
US12442982B2Oct 14, 2025
Temperature sensor to achieve thermal stabilization of micro-ring resonator (MRR) in an open cavity photonic integrated circuit (OCPIC)
INTEL CORP0 citations62
US12436413B2Oct 7, 2025
Undercut design with a bonded base cover for friendly assembly and effective thermal tuning of micro-ring resonator (MRR) in open cavity photonic integrated chips (OCPIC)
INTEL CORP0 citations62
US12406914B2Sep 2, 2025
Ultra-thin, hyper-density semiconductor packages
INTEL CORP0 citations62
US12334472B2Jun 17, 2025
Multiple wafer stack architecture to enable singulation
INTEL CORP0 citations62
US12327814B2Jun 10, 2025
Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavity
INTEL CORP0 citations62
US12176268B2Dec 24, 2024
Open cavity bridge co-planar placement architectures and processes
INTEL CORP0 citations62
US12044888B2Jul 23, 2024
Silicon groove architectures and manufacturing processes for passive alignment in a photonics die
INTEL CORP0 citations62
US12027448B2Jul 2, 2024
Open cavity bridge power delivery architectures and processes
INTEL CORP1 citations62
US11735495B2Aug 22, 2023
Active package cooling structures using molded substrate packaging technology
INTEL CORP1 citations62
US11616283B2Mar 28, 2023
5G mmWave antenna architecture with thermal management
INTEL CORP0 citations62
US11056466B2Jul 6, 2021
Package on package thermal transfer systems and methods
INTEL CORP0 citations62
US11804456B2Oct 31, 2023
Wirebond and leadframe magnetic inductors
INTEL CORP0 citations61
US12599050B2Apr 7, 2026
Multi-level die coupled with a substrate
INTEL CORP0 citations60
US11545407B2Jan 3, 2023
Thermal management solutions for integrated circuit packages
INTEL CORP0 citations60
US12148744B2Nov 19, 2024
Optical multichip package with multiple system-on-chip dies
INTEL CORP0 citations59
US12068222B2Aug 20, 2024
Dummy die structures of a packaged integrated circuit device
INTEL CORP1 citations59
US12003023B2Jun 4, 2024
In-package 3D antenna
INTEL CORP0 citations59
US11552035B2Jan 10, 2023
Electronic package with stud bump electrical connections
INTEL CORP0 citations59
US11127706B2Sep 21, 2021
Electronic package with stud bump electrical connections
INTEL CORP1 citations59
US10461003B2Oct 29, 2019
Electronic package that includes multiple supports
INTEL CORP1 citations59
US11581240B2Feb 14, 2023
Liquid thermal interface material in electronic packaging
INTEL CORP0 citations58
US12564090B2Feb 24, 2026
Edge-aligned template structure for integrated packages including an integrated circuit device within an opening of the template structure
INTEL CORP0 citations52
US12500132B2Dec 16, 2025
Formation of a reconstituted circuit device using flow of a material by capillary action
INTEL CORP0 citations52
US12406893B2Sep 2, 2025
Edge-aligned template structure for integrated circuit packages
INTEL CORP0 citations52
US10438930B2Oct 8, 2019
Package on package thermal transfer systems and methods
INTEL CORP0 citations52
US9076882B2Jul 7, 2015
Methods for high precision microelectronic die integration
INTEL CORP0 citations52
US12386127B2Aug 12, 2025
Micro-lens array optically coupled with a photonics die
INTEL CORP0 citations51
US9991243B2Jun 5, 2018
Integrated circuit assembly that includes stacked dice
INTEL CORP0 citations51
US9820384B2Nov 14, 2017
Flexible electronic assembly method
INTEL CORP0 citations51
US12517314B2Jan 6, 2026
High bandwidth optical interconnection architectures
INTEL CORP0 citations50
US12469801B2Nov 11, 2025
Moisture seal coating of hybrid bonded stacked die package assembly
INTEL CORP0 citations50
US12366713B2Jul 22, 2025
Heat dissipation structures for optical communication devices
INTEL CORP0 citations50
US11611164B2Mar 21, 2023
Wideband multi-pin edge connector for radio frequency front end module
INTEL CORP0 citations50
US12541055B2Feb 3, 2026
Electronic device including a lens assembly
INTEL CORP0 citations47
US11222877B2Jan 11, 2022
Thermally coupled package-on-package semiconductor packages
INTEL CORP0 citations47