Inventor

KOO JUNMO

SG6 patents

⚠️ This page may combine multiple inventors who share the name “KOO JUNMO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

1 patent

US9257411B2Feb 9, 2016

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

STATS CHIPPAC LTD7 citations83

STATS CHIPPAC PTE LTD

1 patent

US9865554B2Jan 9, 2018

Integrated circuit packaging system with under bump metallization and method of manufacture thereof

STATS CHIPPAC PTE LTD3 citations72

KOO JUNMO

1 patent

US8399306B2Mar 19, 2013

Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof

KOO JUNMO5 citations64

SHIM IL KWON

1 patent

US9202793B1Dec 1, 2015

Integrated circuit packaging system with under bump metallization and method of manufacture thereof

SHIM IL KWON2 citations61

SAMSUNG ELECTRONICS CO LTD

1 patent

US12388046B2Aug 12, 2025

Semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations58

LIN YAOJIAN

1 patent

US9059157B2Jun 16, 2015

Integrated circuit packaging system with substrate and method of manufacture thereof

LIN YAOJIAN0 citations51