Inventor
LIAO BARTHOLOMEW
SG5 patents
⚠️ This page may combine multiple inventors who share the name “LIAO BARTHOLOMEW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
2 patentsUS9330994B2May 3, 2016
Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring
STATS CHIPPAC LTD22 citations89
US9627338B2Apr 18, 2017
Semiconductor device and method of forming ultra high density embedded semiconductor die package
STATS CHIPPAC LTD1 citations58
JCET SEMICONDUCTOR SHAOXING CO LTD
2 patentsUS12148677B2Nov 19, 2024
Semiconductor device and method of forming ultra high density embedded semiconductor die package
JCET SEMICONDUCTOR SHAOXING CO LTD0 citations58
US11227809B2Jan 18, 2022
Semiconductor device and method of forming ultra high density embedded semiconductor die package
JCET SEMICONDUCTOR SHAOXING CO LTD0 citations58