Inventor
YASUDA HIROYUKI
JP104 patents
⚠️ This page may combine multiple inventors who share the name “YASUDA HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU CHEMICAL CO
16 patentsUS10128143B2Nov 13, 2018
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
SHINETSU CHEMICAL CO9 citations84
US9646868B2May 9, 2017
Wafer temporary bonding method and thin wafer manufacturing method
SHINETSU CHEMICAL CO7 citations84
US8999817B2Apr 7, 2015
Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer
SHINETSU CHEMICAL CO7 citations84
US10297485B2May 21, 2019
Semiconductor device, making method, and laminate
SHINETSU CHEMICAL CO2 citations73
US10242902B2Mar 26, 2019
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
SHINETSU CHEMICAL CO2 citations73
US9941145B2Apr 10, 2018
Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing method
SHINETSU CHEMICAL CO4 citations73
US9934996B2Apr 3, 2018
Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method
SHINETSU CHEMICAL CO5 citations73
US9884979B2Feb 6, 2018
Temporary adhesion method and method for producing thin wafer
SHINETSU CHEMICAL CO3 citations73
US9550931B2Jan 24, 2017
Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same
SHINETSU CHEMICAL CO2 citations73
US9346990B2May 24, 2016
Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same
SHINETSU CHEMICAL CO3 citations73
US9263333B2Feb 16, 2016
Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer
SHINETSU CHEMICAL CO4 citations73
US11069557B2Jul 20, 2021
Method for producing thin wafer
SHINETSU CHEMICAL CO0 citations63
US10658314B2May 19, 2020
Wafer laminate, method for production thereof, and adhesive composition for wafer laminate
SHINETSU CHEMICAL CO1 citations63
US9096032B2Aug 4, 2015
Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
SHINETSU CHEMICAL CO2 citations63
US8735264B2May 27, 2014
Temporary adhesive composition and method for manufacturing thin wafer using the same
SHINETSU CHEMICAL CO2 citations63
US12545761B2Feb 10, 2026
Photocurable fluoropolyether-based elastomer composition and bonding method thereof
SHINETSU CHEMICAL CO0 citations60
SONY CORP
11 patentsUS5511206AApr 23, 1996
Microprocessor based computer with virtual memory space in overwritable memory
SONY CORP157 citations99
US5611061AMar 11, 1997
Method and processor for reliably processing interrupt demands in a pipeline processor
SONY CORP68 citations96
US7158570B2Jan 2, 2007
Motion picture encoding apparatus
SONY CORP34 citations92
US7529298B2May 5, 2009
Picture transmission method, picture transmission method program, storage medium which stores picture transmission method program, and picture transmission apparatus
SONY CORP14 citations84
US6971106B1Nov 29, 2005
System for transferring data between application systems
SONY CORP7 citations74
US6067607AMay 23, 2000
Data control system for a computer's main memory for efficiently realizing virtualization of list structure data lying across a real memory space and a virtual memory space
SONY CORP9 citations74
US12108016B2Oct 1, 2024
Image processing device and method
SONY CORP0 citations63
US11948337B2Apr 2, 2024
Image processing apparatus and method
SONY CORP0 citations63
US11922579B2Mar 5, 2024
Image processing apparatus and method for image processing by deriving voxel and mesh data to generate point cloud data
SONY CORP0 citations63
US11568602B2Jan 31, 2023
Image processing apparatus and method using point cloud generation and a surface of a mesh
SONY CORP0 citations63
US5694599ADec 2, 1997
Data control system for a computer's main memory for efficiently realizing virtualization of list structure data living across a real memory space and a virtual memory space
SONY CORP5 citations63
SONY GROUP CORP
6 patentsUS11943457B2Mar 26, 2024
Information processing apparatus and method
SONY GROUP CORP3 citations75
US12190549B2Jan 7, 2025
Information processing device and method
SONY GROUP CORP1 citations64
US12250387B2Mar 11, 2025
Information processing apparatus and method
SONY GROUP CORP0 citations63
US12231684B2Feb 18, 2025
Information processing device and method
SONY GROUP CORP0 citations63
US12073596B2Aug 27, 2024
Information processing apparatus and method
SONY GROUP CORP0 citations63
US11991348B2May 21, 2024
Information processing device and method
SONY GROUP CORP1 citations63
YASUDA HIROYUKI
4 patentsUS8980525B2Mar 17, 2015
Chemically amplified positive resist composition and patterning process
YASUDA HIROYUKI8 citations83
US8829434B2Sep 9, 2014
Mass spectrometer and mass spectrometry method
YASUDA HIROYUKI5 citations72
US8968982B2Mar 3, 2015
Chemically amplified positive resist composition and patterning process
YASUDA HIROYUKI3 citations62
US8655151B2Feb 18, 2014
Editing apparatus, editing method, program, and recording media
YASUDA HIROYUKI3 citations62
SHIMADZU CORP
2 patentsAIST
2 patentsIBIDEN CO LTD
1 patentJSR CORP
1 patentHITACHI HIGH TECH CORP
1 patentKAWAGUCHI TOSHIYUKI
1 patentAGENCY IND SCIENCE TECHN
1 patentMITSUBISHI ELECTRIC CORP
1 patentHITACHI INT ELECTRIC INC
1 patentNAT INST OF ADVANCED IND SCIEN
1 patentSUMITOMO BAKELITE CO
1 patentShowing the top 50 of 104 patents by PatentIndex Score.