P

Inventor

YASUDA HIROYUKI

JP104 patents
⚠️ This page may combine multiple inventors who share the name “YASUDA HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINETSU CHEMICAL CO

16 patents
US10128143B2Nov 13, 2018

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

SHINETSU CHEMICAL CO9 citations84
US9646868B2May 9, 2017

Wafer temporary bonding method and thin wafer manufacturing method

SHINETSU CHEMICAL CO7 citations84
US8999817B2Apr 7, 2015

Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer

SHINETSU CHEMICAL CO7 citations84
US10297485B2May 21, 2019

Semiconductor device, making method, and laminate

SHINETSU CHEMICAL CO2 citations73
US10242902B2Mar 26, 2019

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

SHINETSU CHEMICAL CO2 citations73
US9941145B2Apr 10, 2018

Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing method

SHINETSU CHEMICAL CO4 citations73
US9934996B2Apr 3, 2018

Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method

SHINETSU CHEMICAL CO5 citations73
US9884979B2Feb 6, 2018

Temporary adhesion method and method for producing thin wafer

SHINETSU CHEMICAL CO3 citations73
US9550931B2Jan 24, 2017

Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same

SHINETSU CHEMICAL CO2 citations73
US9346990B2May 24, 2016

Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same

SHINETSU CHEMICAL CO3 citations73
US9263333B2Feb 16, 2016

Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer

SHINETSU CHEMICAL CO4 citations73
US11069557B2Jul 20, 2021

Method for producing thin wafer

SHINETSU CHEMICAL CO0 citations63
US10658314B2May 19, 2020

Wafer laminate, method for production thereof, and adhesive composition for wafer laminate

SHINETSU CHEMICAL CO1 citations63
US9096032B2Aug 4, 2015

Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method

SHINETSU CHEMICAL CO2 citations63
US8735264B2May 27, 2014

Temporary adhesive composition and method for manufacturing thin wafer using the same

SHINETSU CHEMICAL CO2 citations63
US12545761B2Feb 10, 2026

Photocurable fluoropolyether-based elastomer composition and bonding method thereof

SHINETSU CHEMICAL CO0 citations60

SONY CORP

11 patents
US5511206AApr 23, 1996

Microprocessor based computer with virtual memory space in overwritable memory

SONY CORP157 citations99
US5611061AMar 11, 1997

Method and processor for reliably processing interrupt demands in a pipeline processor

SONY CORP68 citations96
US7158570B2Jan 2, 2007

Motion picture encoding apparatus

SONY CORP34 citations92
US7529298B2May 5, 2009

Picture transmission method, picture transmission method program, storage medium which stores picture transmission method program, and picture transmission apparatus

SONY CORP14 citations84
US6971106B1Nov 29, 2005

System for transferring data between application systems

SONY CORP7 citations74
US6067607AMay 23, 2000

Data control system for a computer's main memory for efficiently realizing virtualization of list structure data lying across a real memory space and a virtual memory space

SONY CORP9 citations74
US12108016B2Oct 1, 2024

Image processing device and method

SONY CORP0 citations63
US11948337B2Apr 2, 2024

Image processing apparatus and method

SONY CORP0 citations63
US11922579B2Mar 5, 2024

Image processing apparatus and method for image processing by deriving voxel and mesh data to generate point cloud data

SONY CORP0 citations63
US11568602B2Jan 31, 2023

Image processing apparatus and method using point cloud generation and a surface of a mesh

SONY CORP0 citations63
US5694599ADec 2, 1997

Data control system for a computer's main memory for efficiently realizing virtualization of list structure data living across a real memory space and a virtual memory space

SONY CORP5 citations63

SONY GROUP CORP

6 patents

YASUDA HIROYUKI

4 patents

SHIMADZU CORP

2 patents

AIST

2 patents

IBIDEN CO LTD

1 patent

JSR CORP

1 patent

HITACHI HIGH TECH CORP

1 patent

KAWAGUCHI TOSHIYUKI

1 patent

AGENCY IND SCIENCE TECHN

1 patent

MITSUBISHI ELECTRIC CORP

1 patent

HITACHI INT ELECTRIC INC

1 patent

NAT INST OF ADVANCED IND SCIEN

1 patent

SUMITOMO BAKELITE CO

1 patent

Showing the top 50 of 104 patents by PatentIndex Score.